Package Substrate Low Impedance Transient Current Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently supplying transient current to semiconductor elements due to high impedance in the transmission path, leading to electromagnetic noise and limitations in high-frequency operations.
Innovation Solution
A semiconductor package configuration featuring a multilayer package substrate with copper metallic layers, a dielectric layer, and capacitors, where the metallic layers function as low-impedance transmission paths to supply transient current from capacitors to semiconductor elements, reducing inductance components and impedance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional transmission paths are used to supply transient current, then the structure is simple, but the impedance is high causing electromagnetic noise
Solution Approach 1:
The patent transitions from planar two-dimensional routing to three-dimensional vertical stacking by placing capacitors and conducting vias at different depth levels within the substrate. This dimensional change creates multiple current supply paths (first and second transmission paths) that operate in parallel, reducing overall impedance and electromagnetic noise while managing structural complexity through vertical integration.
Solution Approach 2:
The transmission path is segmented into multiple independent routes: a first transmission path through the first via and first capacitor, and a second transmission path through the second via and second capacitor. This segmentation divides the current supply function across multiple parallel channels, reducing the impedance of each individual path and thereby reducing electromagnetic noise through distributed current distribution.
2Speed
If simple transmission paths are used, then the device complexity is low, but the transient current supply capability is insufficient for high-frequency operations
Solution Approach 1:
By utilizing the third dimension (vertical depth) within the substrate, the patent creates multiple layers of capacitors and vias at different positions. This enables parallel current supply paths that reduce overall impedance and enhance transient current delivery speed, supporting high-frequency operations while containing complexity through compact vertical integration rather than lateral expansion.
Solution Approach 2:
The patent merges multiple functions into the substrate structure: the substrate simultaneously serves as the mounting platform for semiconductor elements, the housing for capacitors, and the transmission medium for current delivery. The first and second transmission paths are merged into a unified substrate architecture, reducing overall device complexity while enhancing speed through parallel current supply capabilities.
3Reliability
If multiple transmission paths are created to reduce impedance, then the transient current supply improves, but the device complexity increases
Solution Approach 1:
Multiple transmission paths are merged into a single integrated substrate structure rather than being implemented as separate external components. The first and second vias, along with their associated capacitors, are embedded within the substrate matrix, creating a unified architecture that provides redundant current supply paths (improving reliability) while minimizing overall device complexity through spatial consolidation.
Solution Approach 2:
The patent resolves the complexity issue by transitioning from horizontal to vertical arrangement of transmission path components. Capacitors and vias are positioned at different depth levels within the substrate, creating parallel current paths that improve transient current supply reliability while containing the structural footprint and managing complexity through three-dimensional spatial organization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves low impedance characteristics, reducing electromagnetic noise and enabling high-frequency operations by effectively supplying transient current, as demonstrated by impedance characteristics of 0.3Ω or less over 2.0 GHz, outperforming comparative examples.
Implementation Method 1
the metallic layers function as low-impedance transmission paths to supply transient current from capacitors to semiconductor elements, reducing inductance components and impedance characteristics
Implementation Method 2
The solution achieves low impedance characteristics, reducing electromagnetic noise and enabling high-frequency operations by effectively supplying transient current
Data Source
AI summary
A semiconductor package includes a semiconductor element, a capacitor, and a package substrate. The capacitor supplies transient current to the semiconductor element. The semiconductor element and the capacitor are mounted on the package substrate. The semiconductor element includes an integrated circuit, a first connecting part, and a second connecting part. The capacitor includes a third connecting part and a fourth connecting part. The package substrate includes a first metallic layer, a second metallic layer, and a dielectric layer. The first metallic layer includes a first conductive region, a second conductive region, a third conductive region, and a fourth conductive region. The first conductive region is connected via a fifth connecting part to the second metallic layer. The third conductive region is connected via a sixth connecting part to the second metallic layer. The second and fourth conductive regions are connected to each other inside the first metallic layer.