Package Substrate Trench Reinforcement for Electrical Isolation
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Solution Overview
Problem
Existing package substrates face challenges in electrically isolating conductive patterns between adjacent package regions during the packaging process, leading to potential electrical shorts and requiring complex removal processes of insulation and conductive lines in boundary regions.
Innovation Solution
A package substrate design featuring a core insulation layer with upper and lower conductive patterns, insulation patterns with trenches and reinforcing portions, and insulation holes to isolate conductive patterns, allowing for efficient electrical isolation and reinforced strength in boundary regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation patterns and conductive lines are removed in boundary regions to electrically isolate package regions, then electrical isolation between package regions is improved, but structural strength and integrity of the package substrate deteriorate
Solution Approach 1:
The boundary region is segmented into multiple trenches (first trench, second trench, third trench) that divide and isolate conductive patterns from adjacent package regions. This segmentation achieves electrical isolation while maintaining the overall structural framework of the substrate.
Solution Approach 2:
The insulation pattern is configured with varying thickness and structure at different locations: thicker in boundary regions where isolation is needed, and thinner in package regions where electrical connection is required. This local variation optimizes both isolation performance and structural strength.
2Reliability
If insulation pattern is removed to expose core insulation layer for electrical isolation, then electrical isolation is improved, but manufacturing complexity increases due to additional removal processes
Solution Approach 1:
The insulation pattern is pre-configured with trenches and varying thickness during the formation process, so that electrical isolation structures are already in place before final packaging. This preliminary configuration reduces the need for complex post-formation removal processes.
Solution Approach 2:
The insulation pattern combines multiple functions: it provides electrical isolation through trenches in boundary regions, maintains structural support through controlled thickness variations, and exposes conductive patterns where needed. By merging these functions into a single integrated structure, the number of separate manufacturing steps is reduced.
Data Source
AI summary
A package substrate includes: a core insulation layer having first and second package regions and a boundary region between the first and second package regions; a first upper conductive pattern in the first package region; a second upper conductive pattern in the second package region; a first insulation pattern on the core insulation layer to partially expose the first and second upper conductive patterns, wherein the first insulation pattern includes a first trench at the boundary region, and first reinforcing portions in the first trench; a first lower conductive pattern in the first package region; a second lower conductive pattern in the second package region; and a second insulation pattern on the core insulation layer to partially expose the first and second lower conductive patterns, wherein the second insulation pattern includes a second trench at the boundary region, and second reinforcing portions in the second trench.