Package Substrate Via Density Adjustment for Signal Uniformity
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Solution Overview
Problem
Existing package substrates face challenges in ensuring uniform signal transmission speeds between electronic components due to variations in signal line widths and thicknesses, leading to potential processing delays and inefficiencies, especially when multiple dedicated wiring layers are formed.
Innovation Solution
The package substrate design includes a dedicated first conductor layer with fine conductor circuits and a second conductor layer, connected via outermost and skip via conductors, which reduces variations in signal line characteristics and increases data transmission speed by minimizing the distance between electronic components and dedicated wiring circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multiple dedicated wiring layers are formed to increase data transmission speed, then the connection between electronic components is improved, but variations in signal line widths and thicknesses cause non-uniform signal transmission speeds
Solution Approach 1:
The patent applies local quality by forming a via conductor density adjustment layer in specific regions where via conductors are densely arranged. This layer compensates for local variations in signal transmission characteristics caused by the high density of via conductors, thereby maintaining uniform signal transmission speeds across different regions of the substrate while preserving the high-speed transmission benefits of multiple wiring layers.
Solution Approach 2:
The patent changes physical parameters by introducing a via conductor density adjustment layer with different dielectric properties than the surrounding insulation layers. This parameter change compensates for the electrical effects of dense via conductor arrangements, balancing signal transmission characteristics across the substrate and eliminating variations in transmission speed without reducing the number of wiring layers.
2Reliability
If via conductors are densely arranged to improve connection reliability, then connection between layers is enhanced, but signal transmission speed becomes non-uniform
Solution Approach 1:
The via conductor density adjustment layer is strategically placed in regions with high via conductor density to locally compensate for signal transmission variations. This maintains connection reliability in dense areas while restoring signal speed uniformity across the entire substrate.
Solution Approach 2:
The patent converts the harmful effect of dense via conductor arrangements (signal transmission non-uniformity) into a manageable condition by using the via conductor density adjustment layer to compensate for the electrical effects, thereby maintaining both high connection reliability and uniform signal transmission.
3Speed
If signal line widths and thicknesses are increased to improve signal transmission, then data transmission speed increases, but manufacturing complexity increases
Solution Approach 1:
Instead of uniformly increasing signal line widths and thicknesses, the patent uses parameter changes in the via conductor density adjustment layer to compensate for transmission variations. This maintains signal transmission speed while avoiding the manufacturing complexity associated with uniformly thicker or wider conductors across the entire substrate.
Data Source
AI summary
A package substrate includes an inner interlayer, a first conductor layer on the inner interlayer, a second conductor layer on which the inner interlayer is formed, an outermost interlayer on the first conductor layer, an outermost conductor layer on the outermost interlayer and including first and second pads positioned to mount first and second electronic components on the outermost interlayer, outermost vias connecting the first and outermost conductor layers through the outermost interlayer, and skip vias connecting the outermost and second conductor layers through the outermost and inner interlayers. The first conductor layer includes a first circuit connecting two outermost vias, and the outermost conductor layer includes an outermost circuit connecting one of the two outermost vias and one skip via such that the first conductor circuit, two outermost vias, outermost circuit and one skip via form a connection path connecting one second pad and the second conductor layer.