Package Substrate Assembly for Ultra-Thin Warp-Resistant Boards
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Solution Overview
Problem
Conventional package substrates are prone to warping, bending, or other deformations during fabrication, making them unsuitable for ultra-thin dielectric layers and limiting their ability to meet the demands of thinning and high integration in semiconductor devices.
Innovation Solution
A method involving a multi-layer board assembly process where the assembly is pressed onto support members, using stacked conductive blind vias to enhance toughness, allowing for the use of ultra-thin dielectric layers and avoiding deformations, and enabling processing with conventional equipment to achieve thin substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a coreless embedded circuit specification is used to achieve high integration and miniaturization, then the substrate can be made thinner and lighter, but the substrate becomes non-tough, weak, and prone to warping, bending or other deformations
Solution Approach 1:
The patent applies preliminary action by forming a support structure within the substrate during the fabrication process before the substrate is fully assembled. The support structure is embedded in the dielectric layer to provide reinforcement, preventing warping and bending while allowing the substrate to maintain its thin profile. This preliminary structural reinforcement resolves the contradiction between thinness and strength.
2Manufacturing precision
If a coreless embedded circuit specification is used to achieve high integration, then the substrate can accommodate fine-pitch circuits, but the substrate becomes weak and difficult to process with conventional equipment
Solution Approach 1:
The patent employs composite materials by combining the dielectric layer with an embedded support structure made of different material properties. This composite construction provides the necessary mechanical strength for processing with conventional equipment while maintaining the fine-pitch circuit requirements. The support structure acts as a reinforcement that enables manufacturing precision without sacrificing ease of manufacture.
3Volume of moving object
If the substrate is made thinner to meet the demand for thinning, then the substrate can be lighter and more compact, but ultra-thin dielectric layers cannot be used during the fabricating process
Solution Approach 1:
The patent applies preliminary action by pre-forming the support structure within the dielectric layer during fabrication. This embedded support provides mechanical stability that enables the use of ultra-thin dielectric layers without compromising fabrication reliability. The support structure is established before final substrate assembly, allowing thin substrates to be manufactured with conventional equipment while maintaining process reliability.
Data Source
AI summary
Provided is a method of fabricating a package substrate, including sequentially forming each of first metal layers and each of second metal layers on two opposite surfaces of a board body; forming a circuit structure on each of the second metal layers, thereby forming a multi-layer board assembly; positioning each of the multi-layer board assemblies on each of opposite sides of a support member; using the second metal layer adjacent to the support member as a separation line to separate into a processing board member and two intermediate board members; positioning each of the intermediate board members on each of opposite sides of another support member; removing the board body and the first metal layers to obtain another processing board member; forming a wiring layer on each of the circuit structures of the processing board members; and removing the support members.