Package Substrate Warpage Correction via Pre-Rotation During Die Attach Film Curing
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Solution Overview
Problem
Semiconductor packages experience warpage during the curing process due to the weight of semiconductor chips and the heat application, leading to manufacturing inefficiencies and potential defects.
Innovation Solution
Obtain warpage information from a reference package substrate, rotate the package substrate at specific angles based on this information to correct warpage, and apply heat to cure the die attach film while ensuring optimal alignment and heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is applied to cure the die attach film on a package substrate with semiconductor chips, then the die attach film is cured and chips are attached, but warpage occurs in the package substrate due to heat application and chip weight
Solution Approach 1:
The patent applies preliminary action by rotating the package substrate at a predetermined angle (e.g., 180 degrees) before the curing process begins. This pre-rotation compensates for the expected downward warpage that will occur during heating, allowing the substrate to return to a flat state after curing, thus preventing manufacturing defects.
Solution Approach 2:
The patent implements preliminary anti-action by introducing an opposing rotational angle that counteracts the anticipated warpage deformation. The substrate is rotated in the opposite direction of the expected warpage curvature, creating a pre-compensation effect that neutralizes the thermal and gravitational deformation during curing.
2Manufacturing precision
If the package substrate is rotated to correct warpage, then manufacturing precision is improved, but process complexity increases due to additional rotation steps
Solution Approach 1:
The patent applies parameter changes by modifying the rotational angle parameter of the substrate holder. By adjusting this single parameter (rotation angle) based on the specific warpage characteristics of different substrate configurations, the system achieves precise warpage compensation without requiring complex mechanical adjustments or multiple process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively corrects warpage in semiconductor packages, improving manufacturing efficiency and reducing defects by ensuring proper alignment and heat distribution during the curing process.
Implementation Method 1
applying heat to the package substrate to cure the second die attach film
Data Source
AI summary
In a method of manufacturing a semiconductor package, information with respect to a downward warpage of a reference package substrate, which may be bent with respect to a long axis and/or a short axis of the reference package substrate in applying heat to the reference package substrate to which a plurality of semiconductor chips may be attached using a die attach film (DAF), may be obtained. A package substrate, which may include a first surface to which the semiconductor chips may be attached using the DAF and a second surface opposite to the first surface, may be rotated with respect to the long axis or the short axis at an angle selected based on the information. The heat may be applied to the package substrate to cure the DAF and correct a warpage of the package substrate. Thus, warpage of the package substrate may be corrected for.