Semiconductor Package Substrate Pre-Cut Structure for Warpage Relief
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Solution Overview
Problem
Existing semiconductor packages face challenges in providing flexible and efficient electrical connections between integrated circuit dies and external devices, leading to issues such as warpage and fabrication complexity, particularly in advanced packaging configurations like system-on-integrated-substrate (SoIS) and 3D IC devices.
Innovation Solution
A method involving the formation of a redistribution structure with insulating and conductive layers, pre-cut to create reduced structures, and encapsulation with an insulating material to mitigate bonding stress and enhance structural integrity, allowing for flexible placement of semiconductor devices and improved electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing semiconductor package structures are used, then electrical connections can be established, but warpage occurs and fabrication complexity increases
Solution Approach 1:
The package substrate is divided into multiple functional layers including redistribution layers, insulating layers, and conductive layers. Each layer performs a specific function in the electrical connection pathway, allowing for modular fabrication and reducing overall complexity while maintaining connection reliability
Solution Approach 2:
The patent transitions from planar 2D connections to 3D vertical connections through stacked layers. Conductive layers and vias create three-dimensional electrical pathways, enabling complex routing in a compact footprint while reducing warpage through distributed stress management across multiple layers
2Adaptability or versatility
If advanced packaging configurations like SoIS and 3D IC are implemented, then electrical connection flexibility improves, but warpage and fabrication complexity worsen
Solution Approach 1:
The redistribution layers are selectively formed in different regions of the package substrate with varying conductor patterns and densities. This allows local optimization of electrical connections for different device placement requirements while maintaining overall structural integrity and reducing fabrication complexity through region-specific processing
Solution Approach 2:
The package substrate structure is pre-configured with multiple conductive and insulating layers before device attachment. This preliminary structuring enables flexible device placement and routing decisions later in the fabrication process without increasing overall complexity, as the foundational electrical infrastructure is already in place
3Ease of manufacture
If conventional package structures are used, then fabrication process is simpler, but warpage occurs reducing manufacturing precision
Solution Approach 1:
The package substrate employs composite structures combining multiple materials with different mechanical and electrical properties. Insulating layers, conductive layers, and redistribution layers are stacked to create a composite structure that inherently compensates for thermal expansion differences and reduces warpage while maintaining fabrication simplicity through standardized layering processes
Data Source
AI summary
A semiconductor package provided herein includes a package substrate and a semiconductor device. The package substrate includes a redistribution structure, an interconnect structure bonded to the interconnect structure and an insulation material laterally surrounding the interconnect structure, wherein the redistribution structure has a reduced structure and the insulation material fills the reduced structure. The semiconductor device is bonded to the package substrate. In addition, a method of fabricating a semiconductor package is also provided and includes a precut process forming the reduced structure in the redistribution structure of the package substrate.