Semiconductor Package Support Structure for Coplanarity and Debonding
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Solution Overview
Problem
Warpage, coplanarity, and heat dissipation issues in three-dimensional integrated circuits (3DICs) pose challenges in semiconductor package assembly, with existing solutions like stiffener rings and thermal interface materials (TIMs) being inadequate due to material mismatch and limited candidate materials.
Innovation Solution
A support structure comprising a ring portion and a lid portion integrated with a removable adhesive layer, which is designed to be easily detached using radiation, providing improved coplanarity and reducing manufacturing costs without local deformation or delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If stiffener rings and thermal interface materials are used to address warpage and heat dissipation, then structural support and thermal management are improved, but material mismatch causes delamination and crack issues
Solution Approach 1:
The patent introduces a support structure as an intermediary component between the package substrate and the device package. This support structure acts as a mediator that provides mechanical reinforcement to reduce warpage without direct material bonding that causes delamination. The support structure is positioned to provide structural support while avoiding the material mismatch issues between dissimilar materials like stiffener rings and package substrates.
Solution Approach 2:
The support structure is designed as a temporary component that is removed after serving its purpose during packaging. This disposable approach allows the support structure to provide necessary mechanical support during critical manufacturing and assembly phases, then be discarded once the package is complete, eliminating the need for permanent material bonds that cause delamination and crack issues.
2Device complexity
If traditional bonding methods are used to stack semiconductor dies and bond to package components, then three-dimensional integrated circuits are formed, but warpage and coplanarity issues arise
Solution Approach 1:
The support structure is attached to the package substrate before the device package is placed on it. This preliminary action provides a pre-formed, rigid platform that ensures coplanarity is established before subsequent bonding and assembly steps. By preparing the support structure in advance, the patent prevents warpage and coplanarity issues that would otherwise arise during the stacking and bonding processes of three-dimensional integrated circuits.
3Strength
If fixing components like screws are used to attach lid to stiffener ring, then structural integrity is improved, but local deformation occurs and throughput is reduced
Solution Approach 1:
The patent replaces the mechanical fastening system (screws and fixing components) with a bonding-based system using adhesive layers. This substitution eliminates the need for mechanical penetration and local deformation caused by screw holes, while maintaining structural integrity through distributed adhesive bonding. The bonding process is also more compatible with automated manufacturing, improving throughput compared to manual or semi-automatic screw fastening.
4Temperature
If thermal interface materials are used between lid and device package, then heat dissipation is improved, but delamination and crack occur due to CTE mismatch
Solution Approach 1:
The patent removes the thermal interface material layer from the design by making the lid portion itself transparent to radiation and allowing direct radiative heat transfer. This extraction of the thermal interface material eliminates the source of delamination and crack issues caused by CTE mismatch, while maintaining effective heat dissipation through radiation. The lid portion is designed to directly interface with the device package without intermediate thermal materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support structure enhances coplanarity and throughput while eliminating delamination and crack issues, allowing for efficient de-bonding processes and reducing processing costs.
Implementation Method 1
a releasable adhesive layer between the lid portion and the ring portion, wherein the lid portion is made of a material transparent to a radiation, and a releasable adhesive layer between the lid portion and the ring portion
Data Source
AI summary
A package assembly includes a device package including an encapsulated die and an interposer disposed below the encapsulated die, a package substrate disposed below the device package and electrically coupled to the encapsulated die through the interposer, and a support structure disposed on the package substrate. The device package is housed in a cavity formed by the support structure and the support structure. The support structure includes a lid portion made of a material transparent to a radiation, a ring portion between the lid portion and the package substrate, and a releasable adhesive layer being response to the radiation.