Semiconductor Package Support Structure to Prevent Electrode Deformation
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Solution Overview
Problem
Existing semiconductor package structures face challenges with thin extraction electrodes that are prone to deformation during transportation and installation, affecting yield and reliability, especially when subjected to mechanical stress like shaking, which can lead to power failures.
Innovation Solution
A supportable package device design featuring a package body with a conductive body encapsulated by an encapsulating body and supported by extraction electrodes that are integrated with the package body, reducing reliance on thin electrodes for support and enhancing structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If thin extraction electrodes are used to support the package body, then the package structure can be simplified and manufacturing cost reduced, but the electrodes are prone to deformation during transportation and installation, affecting yield and reliability
Solution Approach 1:
The support function is segmented between the extraction electrodes and the support body. The extraction electrodes provide electrical connectivity while the support body provides mechanical support, separating the support function from the thin electrodes to prevent deformation.
Solution Approach 2:
A support body is introduced as an intermediary element between the package body and the extraction electrodes. This support body bears the mechanical load and protects the thin extraction electrodes from deformation during transportation and installation.
2Device complexity
If thin extraction electrodes are used for electrical connectivity, then device complexity is reduced, but mechanical stress during shaking can lead to power failures
Solution Approach 1:
The mechanical support function is segmented away from the extraction electrodes and assigned to the support body. This allows the extraction electrodes to remain thin for electrical connectivity while the support body provides the necessary mechanical strength to withstand shaking and stress.
Solution Approach 2:
The support body acts as a mediator that absorbs and distributes mechanical stress, protecting the thin extraction electrodes from direct mechanical stress during shaking and handling, thereby preventing power failures.
3Device complexity
If weight is concentrated on thin extraction electrodes, then package assembly is simplified, but yield and reliability are affected due to electrode deformation
Solution Approach 1:
The weight support function is segmented from the extraction electrodes and assigned to the support body. This segmentation allows the extraction electrodes to remain thin and simple for assembly while the support body bears the weight, preventing deformation and improving production yield.
Solution Approach 2:
The support body serves as a mediator that carries the weight of the package assembly, protecting the thin extraction electrodes from bearing excessive load. This intermediary structure prevents electrode deformation and improves production yield without complicating the assembly process.
4Reliability
If a support body is added to the package structure, then structural integrity and reliability are improved, but device complexity increases
Solution Approach 1:
The support body is merged with the package body structure, forming an integrated component that provides both structural support and housing functions. This merging approach improves structural integrity while minimizing the increase in device complexity by combining multiple functions into a single element.
Data Source
AI summary
A package device can include: a package body having a support body and an encapsulating body configured to encapsulate a conductive body of the package device; at least one extraction electrode electrically connected to the conductive body, and having a part exposed outside the package body; and where the support body is located on only part of a bottom surface of the encapsulating body, and protrudes from the bottom surface of the encapsulating body to form a cavity defined by the remaining exposed bottom surface of the encapsulating body and inner side surface of the supporting body.