Electronic Package Support Structure for High-Temperature Warpage
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Solution Overview
Problem
Conventional semiconductor packages are prone to warping at high temperatures, leading to short circuits and non-wetting issues due to bridging of adjacent conductive elements and poor contact between copper pillars and solder materials.
Innovation Solution
A semiconductor packaging method involving a carrier structure with insulator support members evenly or non-evenly distributed, bonded to conductive elements, which supports the electronic module during hot-pressing to prevent deformation and ensure reliable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic module is bonded to the package substrate via copper pillars and solder materials at high temperatures, then the electrical connection is achieved, but the electronic module warps causing short circuits and non-wetting issues
Solution Approach 1:
The patent applies preliminary action by placing support members on the carrier structure before bonding the electronic module. These support members are positioned in advance to provide mechanical support during the high-temperature bonding process, preventing warping before it occurs. The support members are removed after bonding is complete, having fulfilled their preventive function.
Solution Approach 2:
The support members act as intermediary elements between the carrier structure and the electronic module during the bonding process. They transfer and distribute the mechanical loads and thermal stresses, mediating the interaction between the bonding process and the electronic module to prevent direct warping caused by high temperatures and reflow processes.
2Stability of the object's composition
If support members are added to prevent warping, then shape stability is improved, but device complexity increases
Solution Approach 1:
The support members are designed to be removable after serving their purpose, allowing the package structure to return to its original state without permanent modifications. This temporary intervention adds complexity only during the manufacturing process, not in the final product.
Solution Approach 2:
The support members are discarded after fulfilling their function of preventing warping during bonding. They are removed from the package structure, allowing the electronic module to be properly connected to the package substrate without the temporary support elements, thus recovering a simpler final structure.
3Stability of the object's composition
If the electronic module is constrained during bonding, then warping is prevented, but bonding precision may be affected
Solution Approach 1:
The support members are strategically positioned at specific locations on the carrier structure where warping is most likely to occur. Rather than constraining the entire electronic module uniformly, the support members provide localized support only where needed, allowing other areas to maintain their natural positioning for precise bonding.
Solution Approach 2:
The support members provide more support than strictly necessary at critical locations, ensuring complete prevention of warping. This excessive local support is acceptable because the support members are temporary and will be removed, allowing for complete bonding precision without permanent interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents warping of the electronic module at high temperatures, avoiding short circuits and non-wetting issues, thereby enhancing the reliability of the semiconductor package.
Implementation Method 1
the electronic module 1a is prone to warping (as shown by the outline of dotted lines in FIG. 1) at high temperatures (such as during the process of reflowing the solder materials 17)
Implementation Method 2
the solder materials 17 are reflowed to fix the electronic module 1a on the package substrate 16
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which support members are disposed on a carrier structure having a plurality of electrical contact pads, and a conductive element is bonded on each of the electrical contact pads, and an electronic module is disposed on the carrier structure via the conductive elements, so that the support members contact and support the electronic module to prevent the electronic module from warping.