Semiconductor Package Support Structure for Warpage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in managing warpage of semiconductor packages due to the integration of various components, which affects the coplanarity and stability of the package structure, particularly when incorporating photonic and electronic integrated circuits.
Innovation Solution
A warpage control structure is attached to the substrate to reinforce the package structure, using materials like metal, semiconductor, or dielectric materials, and is designed with various components such as wall portions, connection portions, and block portions to separate and stabilize the first and second package components, enhancing structural stability and coplanarity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If various package components are integrated onto the substrate, then the functionality and integration density are improved, but warpage and coplanarity issues worsen
Solution Approach 1:
The supporting structure is divided into multiple functional segments including wall portions that define regions, connection portions that bridge different areas, and block portions that provide localized support. This segmentation allows different parts of the substrate to be supported independently, compensating for localized warpage while maintaining overall integration density.
Solution Approach 2:
The supporting structure is selectively positioned at specific locations where warpage occurs, rather than uniformly across the entire substrate. The wall portions, connection portions, and block portions are strategically placed to provide localized support where needed, maintaining coplanarity without adding unnecessary structure throughout the entire package.
2Stability of the object's composition
If a supporting structure is added to control warpage, then coplanarity and structural stability are improved, but device complexity increases
Solution Approach 1:
Multiple functions are merged into a single supporting structure: the wall portions provide regional definition and support, the connection portions provide structural bridging, and the block portions provide localized reinforcement. This consolidation achieves comprehensive warpage control without requiring multiple separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The supporting structure serves multiple purposes simultaneously: it provides mechanical support to prevent warpage, defines regional boundaries for package components, and maintains coplanarity across the substrate. This multi-functionality reduces the need for additional specialized components, offsetting the complexity increase with functional consolidation.
Data Source
AI summary
A package includes a substrate, a first package component, second package components and a supporting structure. The first package component and the second package components are bonded to the substrate. The second package components are electrically connected to the first package component. Each of the second package components includes a n optical coupler. The supporting structure is attached on the substrate. At least a portion of the supporting structure is laterally located between the first package component and the second package components.