Semiconductor Package Sealing Surface Prep for Wax-Bleed Adhesion
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Solution Overview
Problem
The adhesion between a first sealing material and a second member, such as a second sealing material or a heat sink, is compromised by the bleeding of a wax component from the first sealing material during subsequent heating steps, leading to potential peeling at their interface.
Innovation Solution
A production method involving adhering a UV peelable adhesive material to the first sealing material, peeling it off, and then providing the second member to the surface from which the adhesive was removed, thereby removing the wax component and enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wax component is added to the curable resin composition to secure releasability from mold, then releasability is improved, but adhesiveness between sealing material and second member deteriorates due to wax bleeding to surface
Solution Approach 1:
The patent applies preliminary action by performing a surface treatment on the sealing material before bonding the second member. The surface treatment removes or modifies the wax component that has bled to the surface, preventing it from interfering with subsequent adhesion. This preparatory step ensures that when the second member is bonded, the wax does not compromise the adhesiveness, thus resolving the contradiction between mold releasability and bonding reliability.
2Reliability
If another sealing material is provided to the surface of the first sealing material to achieve Six-side protection or Active Mold Packaging, then protection performance is improved, but adhesiveness between sealing materials deteriorates due to wax bleeding
Solution Approach 1:
The patent applies preliminary action by performing a surface treatment on the first sealing material before providing the second sealing material. The surface treatment removes or modifies the wax component that has bled to the surface, preventing it from interfering with the adhesion of the second sealing material. This ensures strong bonding between the overlapping sealing materials while maintaining the protection performance of the Six-side protection or Active Mold Packaging structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the adhesiveness between the first and second members, preventing peeling and ensuring a robust interface.
Implementation Method 1
irradiating the adhesive material with ultraviolet rays before the adhesive material is peeled off from the surface of the first sealing material
Data Source
AI summary
A production method for semiconductor packages according to the present disclosure includes: adhering an adhesive material to a surface of a first sealing material, peeling off the adhesive material from the surface of the first sealing material, and providing a second member to the surface of the first sealing material from which the adhesive material was peeled off.