Semiconductor Package Surface Temperature Calibration Without Extra Sensors
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Solution Overview
Problem
Existing semiconductor package testing methods struggle to accurately determine surface temperature, leading to potential misclassification of defective products as normal due to insufficient temperature regulation, necessitating an efficient and accurate method to provide surface temperature measurements.
Innovation Solution
A method and semiconductor package that utilize an integrated reference temperature measurement circuit to generate calibration information, mapping reference temperatures to code values, allowing for accurate surface temperature determination through a conversion function without additional sensors, and generating this information during the burn-in test to minimize test time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If surface temperature is measured using conventional methods without integrated circuits, then additional temperature sensors and separate calibration processes are required, but this increases device complexity, test time, and cost
Solution Approach 1:
The patent combines the temperature measurement circuit with the semiconductor die itself, using the die's inherent electrical characteristics to sense temperature. This eliminates the need for separate temperature sensors and integrates the measurement function into the existing device structure, thereby reducing device complexity while maintaining measurement precision.
Solution Approach 2:
The semiconductor die serves its own temperature measurement function by utilizing its electrical properties (such as voltage-current characteristics) that change with temperature. The die effectively measures its own temperature through self-diagnosis of its electrical behavior, eliminating the need for external measurement systems and reducing overall system complexity.
2Measurement precision
If separate calibration processes are performed outside burn-in test, then temperature calibration can be thorough, but this increases test time and cost
Solution Approach 1:
The patent performs temperature calibration during the burn-in test process itself, which is already a mandatory reliability test. By integrating the calibration activity into the existing burn-in timeframe, the calibration is completed as a preliminary action within the already-scheduled test window, avoiding any additional time loss while ensuring thorough calibration under actual operating conditions.
Solution Approach 2:
The burn-in test serves multiple functions simultaneously: it performs reliability screening, stress testing, and temperature calibration. This multi-functionality allows the calibration process to be embedded within the existing test framework without requiring separate dedicated calibration time, thereby maintaining calibration accuracy while minimizing additional test time and cost.
3Measurement precision
If additional temperature sensors are added to the semiconductor package, then surface temperature can be measured directly, but this increases device complexity and cost
Solution Approach 1:
The patent replaces physical temperature sensors (mechanical/thermal devices) with an electrical measurement approach. By using the semiconductor die's electrical characteristics to infer temperature, the system substitutes an electrical field-based measurement for a thermal sensor-based measurement, thereby eliminating the need for additional physical sensors and reducing package complexity.
Solution Approach 2:
The patent uses the semiconductor die's electrical properties as an intermediary to measure temperature. Instead of directly measuring temperature with a sensor, the die's electrical characteristics (which change predictably with temperature) serve as an intermediary parameter, allowing temperature to be inferred indirectly through electrical measurements, thus avoiding the need for additional temperature sensors.
4Productivity
If conventional testing is performed without accurate surface temperature data, then test process is simple, but defective products may be misclassified as normal
Solution Approach 1:
The patent implements feedback by continuously monitoring the semiconductor die's electrical characteristics during testing and using this information to determine actual operating temperature. This temperature feedback is then used to adjust or interpret test results accurately, ensuring that products are classified correctly based on their actual thermal conditions rather than assumed temperatures, thereby improving reliability without sacrificing test efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and accurate surface temperature measurement of semiconductor packages, reducing test time and cost by integrating the temperature measurement circuit and generating calibration information during the burn-in test, thereby improving test accuracy and reducing misclassification.
Implementation Method 1
measuring a plurality of reference code values respectively corresponding to the plurality of reference temperatures based on a temperature code indicating a junction temperature in the at least one semiconductor die
Data Source
AI summary
A method of providing a surface temperature of a semiconductor package including a semiconductor die that is packaged using a molding material includes setting an air temperature near the semiconductor package to each of reference temperatures, measuring reference code values respectively corresponding to the reference temperatures based on a temperature code indicating a junction temperature in the semiconductor die while the air temperature is set to each of the reference temperatures, the temperature code being provided from a reference temperature measurement circuit integrated in the semiconductor package, generating calibration information that indicates mapping relationships between the reference temperatures and the reference code values, and providing a present surface temperature of the semiconductor package based on the calibration information and a present code value of the temperature code.