Semiconductor Package Test Socket With Reference Module Alignment
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Solution Overview
Problem
Conventional methods for testing semiconductor packages face challenges in establishing electrical connections with encapsulated conductive pads, often requiring mold cap removal, which can damage components and necessitate costly and inconvenient adjustments to test equipment.
Innovation Solution
A test apparatus comprising a test board with a reference module and a test socket that aligns conductive pads of the semiconductor package with test pads on a reference module using contact pins, allowing electrical connection without mold cap removal, thus mimicking the semiconductor package's structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mold cap removal is used to access conductive pads, then electrical connection can be established, but component damage occurs and testing cost increases
Solution Approach 1:
The patent introduces a test socket as an intermediary device between the test equipment and the semiconductor package. The test socket contains contact pins that can penetrate through the mold cap material to reach the conductive pads, eliminating the need for actual mold cap removal while still establishing reliable electrical connections. This intermediary structure resolves the contradiction by providing access to conductive pads without causing component damage.
Solution Approach 2:
The patent creates a reference module that copies the internal structure of the semiconductor package, including the arrangement of conductive pads and electronic components. This reference module allows the test equipment to interact with a replica structure that mimics the actual package, enabling testing without damaging the real semiconductor package or requiring mold cap removal.
2Reliability
If mold cap removal is performed, then electrical connection is achieved, but testing complexity and cost increase
Solution Approach 1:
The patent segments the testing system into distinct functional components: the test equipment, the test socket, and the reference module. The test socket is designed as a separate, reusable component that handles the complex task of penetrating the mold cap and establishing electrical connections. This segmentation allows the test equipment to remain simpler while the test socket absorbs the complexity of mold cap penetration and alignment.
Solution Approach 2:
The test socket serves as an intermediary that bridges the test equipment and the semiconductor package, absorbing the complexity of mold cap penetration and electrical connection establishment. By placing this complex function in a dedicated intermediary component rather than the main test equipment, the overall system architecture becomes more manageable and cost-effective.
3Reliability
If conventional testing methods are used, then electrical connection can be established, but testing convenience deteriorates
Solution Approach 1:
The test socket is designed to be self-aligning and self-securing through its contact pins that automatically penetrate and lock onto the conductive pads when the semiconductor package is placed in the test socket. This self-service mechanism eliminates the need for complex manual alignment procedures or additional adjustment operations, significantly improving testing convenience while maintaining reliable electrical connections.
Solution Approach 2:
The reference module creates a simplified copy of the semiconductor package structure that can be easily manipulated and tested. By working with this reference copy rather than the actual complex semiconductor package, the testing process becomes more convenient and less cumbersome, while still providing reliable testing results through the replicated conductive pad arrangements.
Data Source
AI summary
A apparatus for testing a semiconductor package comprises: a test board; a reference module disposed on the test board, wherein the reference module has a base substrate with a set of test pads and at least one reference electronic component mounted on the base substrate, the at least one reference electronic component has a same composition and layout as the at least one electronic component of the semiconductor package; and a test socket disposed on the test board, wherein the test socket comprises: a socket body for accommodating the reference module and the semiconductor package; and contact pins vertically extending through the socket body to set up an electrical connection between the set of conductive pads of the semiconductor component and the set of test pads of the reference module.