Embedded Package Thermal Conduction via Direct Contact
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Solution Overview
Problem
Conventional package structures for power modules suffer from poor heat dissipation efficiency, which is a challenge in compact electronic devices designed for small size and light weight with integrated circuitry.
Innovation Solution
A package structure with an insulation layer, an embedded electronic component, and a heat dissipation device where the electronic component's first surface is directly in contact with the heat dissipation device, utilizing thermal conduction structures and re-distribution blocks for efficient heat transfer, along with metallic support parts and an inductor for compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are integrated into a single circuit module to achieve small size and light weight, then compactness is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The package structure is segmented into distinct functional zones: an insulation layer containing embedded electronic components, thermal conduction structures positioned at specific locations, and a heat dissipation device. This segmentation allows heat to be conducted from specific hot spots through dedicated thermal pathways rather than relying on passive convection from the entire package.
Solution Approach 2:
Thermal conduction structures serve as intermediary elements between the electronic components and the heat dissipation device. These structures actively mediate heat transfer by providing high thermal conductivity pathways, bridging the gap between the embedded components and the external heat dissipation mechanism.
2Reliability
If electronic components are embedded within an insulation layer, then electrical insulation is improved, but thermal conduction deteriorates
Solution Approach 1:
The insulation layer exhibits local quality variation: it provides electrical insulation throughout the bulk material while containing localized regions of high thermal conductivity where thermal conduction structures are embedded. This allows simultaneous achievement of electrical insulation and thermal conduction in different spatial locations within the same component.
Solution Approach 2:
The package structure uses composite material architecture combining insulation material with embedded thermal conduction structures. This composite approach allows the insulation layer to maintain its electrical insulation properties while incorporating high thermal conductivity elements to facilitate heat transfer, resolving the contradiction between insulation and thermal conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by direct contact between the electronic component and the heat dissipation device, while maintaining a compact form factor through strategic placement of thermal conduction structures and re-distribution blocks.
Implementation Method 1
at least one thermal conduction structure embedded within the insulation layer, wherein the at least one thermal conduction structure is exposed from the insulation layer
Implementation Method 2
the first surface of the electronic component is directly in contact with the heat dissipation device
Implementation Method 3
a heat dissipation device disposed on the top surface of the insulation layer and mounted onto the first surface of the electronic component
Data Source
Figure 1
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AI summary
A package structure (1) includes an insulation layer (10), an electronic component (11), at least one thermal conduction structure (14), a first re-distribution block (131) and a heat dissipation device (12). The electronic component (11) is embedded within the insulation layer (10), and comprises a first surface (110) exposed from a top surface (100) of the insulation layer (10), a second surface (111) and plural conducting terminals (112) formed on the second surface (111). The at least one thermal conduction structure (14) is embedded within the insulation layer (10) and partially exposed from the top surface (100) of the insulation layer (10). One part of the first re-distribution block (131) is disposed on a bottom surface (101) of the insulation layer (10), and the other part of the first re-distribution block (131) is located in the insulation layer (10) and connected with the at least one thermal conduction structure (14) and at least one of the conducting terminals (112). The heat dissipation device (12) is mounted onto the first surface (110) of the electronic component (11).