Embedded Thermal Conduction in Package Structure
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Solution Overview
Problem
Conventional package structures for electronic components, such as SIP, LGA, and BGA, face challenges with high heat dissipation inefficiency, large layout area, high fabricating costs, and labor-intensive assembly processes, particularly in achieving effective heat management and integration in compact electronic devices.
Innovation Solution
A package structure with embedded thermal conduction structures, featuring conductive layers and vias that allow heat to be dissipated vertically and horizontally through thermal conduction paths, reducing thermal resistance and enhancing heat dissipation efficiency while using surface mount technology for high-density integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional package structures (SIP, LGA, BGA) are used, then electronic components can be packaged and installed, but heat dissipation efficiency is insufficient and thermal resistance is high
Solution Approach 1:
The patent introduces embedded thermal conduction structures that extend vertically through the package substrate, creating three-dimensional thermal pathways. This transforms conventional two-dimensional surface-mounted heat dissipation into multi-directional thermal management, allowing heat to conduct both horizontally and vertically through the package structure to external heat sinks or cooling surfaces.
Solution Approach 2:
The patent employs thermal conduction structures (such as thermally conductive adhesive layers, embedded heat dissipation elements, or thermal vias) as intermediary components between the electronic components and the external environment. These intermediaries provide low thermal resistance pathways that efficiently transfer heat away from the components without requiring direct contact or complex external cooling systems.
2Temperature
If single in-line package structure (SIP) is used with large layout area, then heat dissipation capability is good, but the package occupies much space and fabricating cost is high
Solution Approach 1:
The patent utilizes vertical embedding of thermal conduction structures within the package substrate to achieve efficient heat dissipation in the vertical dimension rather than requiring expanded horizontal layout. This allows compact footprint while maintaining thermal performance through multi-layer thermal pathways that conduct heat vertically through the substrate thickness.
Solution Approach 2:
The patent embeds thermal conduction structures within the internal layers of the package substrate, nesting heat dissipation functionality inside the package structure itself. This nested arrangement allows thermal management capabilities to be integrated within the compact package volume without increasing external dimensions or requiring separate external heat dissipation components.
3Area of stationary object
If LGA or BGA package structures are used with high density integration, then layout area is reduced, but heat dissipation efficiency is still insufficient due to single direction heat dissipation
Solution Approach 1:
The patent adds vertical thermal conduction pathways through embedded structures that extend through the substrate thickness, transforming single-direction (horizontal) heat dissipation into multi-directional (horizontal and vertical) thermal management. This enables compact high-density packaging while maintaining efficient heat dissipation through the added vertical dimension.
4Ease of manufacture
If conventional package structures are used, then manufacturing can be performed, but fabricating cost is high and assembling process is time-consuming and labor-intensive
Solution Approach 1:
The patent integrates thermal conduction structures directly into the package substrate manufacturing process, merging thermal management functionality with the base substrate fabrication. This consolidation eliminates separate assembly steps for installing external heat sinks or thermal management components, reducing both manufacturing complexity and assembly time while enabling automated surface-mount technology processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed package structure significantly improves heat dissipation efficiency, reduces fabricating costs, and increases mechanical strength by allowing heat to be transferred through low thermal resistance paths, while maintaining electrical connectivity and compactness.
Implementation Method 1
heat generated from the electronic component can be transferred to the surroundings of the package structure through the low thermal resistance paths of the conductive layers and the thermal conduction structure along vertical and horizontal directions
Data Source
AI summary
A package structure includes an insulation layer, a first conductive layer, a second conductive layer, at least one electronic component, and at least one thermal conduction structure. At least one first conductive via and at least one second conductive via are formed in the insulation layer. The first conductive layer is disposed on a top surface of the insulation layer and contacted with said at least one first conductive via. The second conductive layer is disposed on a bottom surface of the insulation layer and contacted with the second conductive via. The electronic component is embedded within the insulation layer, and includes plural conducting terminals. The plural conducting terminal is electrically connected with the first conductive layer and the second conductive layer through said at least one first conductive via and said at least one second conductive via. Said at least one thermal conduction structure is embedded within the insulation layer.