Semiconductor Package Thermal Coupling to Prevent Delamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturization of electronic products leads to challenges in heat dissipation and warpage of package structures, causing stress and potential catastrophic failures due to thermal cycling, which existing technologies have not adequately addressed.
Innovation Solution
A manufacturing process involving a temporary carrier, insulating encapsulation, redistribution structures, and a thermal coupling structure with a metallic layer and thermal interface material to manage heat dissipation and prevent delamination, including the use of fillers in the insulating encapsulation and a metallic layer conforming to the topography of the encapsulation for improved adhesion and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal conductive structure is disposed between the semiconductor die and lid to improve heat dissipation, then heat dissipation performance is improved, but thermal cycling induces stress causing delamination and cracking
Solution Approach 1:
The patent changes the physical and chemical parameters of the encapsulation material by incorporating fillers with specific thermal expansion coefficients that match the semiconductor die. This parameter adjustment allows the material to withstand thermal cycling stresses without delamination while maintaining heat dissipation performance
Solution Approach 2:
The patent uses composite encapsulation materials consisting of a base material combined with fillers (such as ceramic or metal particles). This composite structure provides both mechanical protection against thermal stress and thermal conduction pathways for heat dissipation, resolving the contradiction between heat management and structural reliability
2Volume of moving object
If the package structure is miniaturized to reduce size, then product miniaturization is achieved, but heat dissipation becomes more difficult and warpage increases
Solution Approach 1:
The patent employs a thin film encapsulation structure that provides mechanical protection while allowing efficient heat transfer. The thin film design reduces thermal resistance in the vertical direction, enabling effective heat dissipation from the semiconductor die even in miniaturized packages
Solution Approach 2:
The patent modifies the thermal conductivity parameter of the encapsulation material by adding high thermal conductivity fillers. This allows the miniaturized package to maintain adequate heat dissipation performance despite reduced overall dimensions
3Device complexity
If existing packaging technologies are used to maintain simple structure, then manufacturing simplicity is preserved, but they fail to address thermal stress and reliability issues
Solution Approach 1:
The patent introduces an encapsulation material as an intermediary layer between the semiconductor die and the external environment. This intermediate structure absorbs and distributes thermal stresses, protecting the die from direct mechanical stress while maintaining electrical and thermal functionality
Solution Approach 2:
The patent applies the encapsulation material before final package assembly, pre-establishing a protective barrier that will withstand subsequent thermal cycling. This preliminary protective action prevents stress concentration and delamination that would occur in conventional approaches
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal stresses, enhances heat dissipation, and prevents interfacial delamination, thereby improving the reliability and performance of package structures by ensuring efficient heat management and structural integrity.
Implementation Method 1
The thermal coupling structure is interposed between the heat dissipating component and the first package component
Implementation Method 2
a thermal coupling structure with a metallic layer and thermal interface material to manage heat dissipation
Implementation Method 3
insulating encapsulation and a thermal coupling structure
Data Source
AI summary
A package structure includes a first semiconductor die, a first insulating encapsulation, a thermal coupling structure, and a heat dissipating component thermally coupled to the first semiconductor die through the thermal coupling structure. The first semiconductor die includes an active side, a rear side, and a sidewall connected to the active side and the rear side. The first insulating encapsulation extends along the sidewall of the first semiconductor die and includes a first side substantially leveled with the active side, a second side opposite to the first side, and topographic features at the second side. The thermal coupling structure includes a metallic layer overlying and the rear side of the first semiconductor die and the topographic features of the first insulating encapsulation. A manufacturing method of a package structure is also provided.