Inter-Package Thermal Element for PoP Heat Dissipation
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Solution Overview
Problem
The increasing thermal challenges in mobile devices due to smaller form factors and higher power consumption in semiconductor packages, particularly in Package on Package (PoP) structures, necessitate improved thermal dissipation methods while maintaining area efficiency.
Innovation Solution
Incorporating a thermal element between the top and bottom packages with cutouts for PoP ball connections, creating an air gap for thermal path access to a system thermal spreader, and using materials like copper or aluminum for effective heat dissipation, along with thermal interface materials to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If Package on Package (PoP) techniques are used to reduce XY area, then area efficiency is improved, but thermal dissipation deteriorates due to increased thermal challenges from higher power consumption and smaller form factors
Solution Approach 1:
The patent introduces a vertical thermal management dimension by placing a heat spreader between the first and second packages in the Z-direction. This allows thermal dissipation to occur through the vertical dimension rather than being constrained to the horizontal plane, effectively managing heat in the third dimension while maintaining compact XY footprint.
Solution Approach 2:
A heat spreader is introduced as an intermediary thermal management component positioned between the first package and second package. This intermediary structure facilitates heat transfer from high-power components in the first package to lower-power components or heat sinks in the second package, acting as a thermal mediator that resolves the thermal conflict in PoP architecture.
2Power
If power consumption increases to improve performance, then processing capability is improved, but thermal challenges worsen due to heat generation
Solution Approach 1:
The patent applies local quality by positioning the heat spreader specifically under high-power generating components in the first package. This localized thermal management approach targets the hottest spots directly, allowing high power consumption in specific areas while maintaining overall thermal balance through localized heat redistribution to cooler regions.
3Area of stationary object
If conventional PoP structures are used, then area efficiency is maintained, but temperature reduction is limited with insufficient thermal dissipation improvement
Solution Approach 1:
The heat spreader serves multiple functions simultaneously: it acts as a thermal conduction path, a structural support element, and a thermal buffer between packages. This multi-functionality allows the same component to address thermal dissipation needs while maintaining area efficiency and structural integrity, achieving both goals without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces maximum die temperature and temperature differences across the die, achieving up to 13°C temperature reduction and 26% to 67% difference reduction compared to conventional PoP structures, while maintaining area efficiency.
Implementation Method 1
a first thermal element positioned between the first package and the second package
Implementation Method 2
wherein the first thermal element is separated from the second package by an air gap
Data Source
AI summary
A package on package semiconductor structure includes a first package positioned above a first surface of a substrate, a second package positioned above the first package, and a first thermal element positioned between the first package and the second package, wherein the first thermal element is separated from the second package by an air gap and the thermal element provides a heat path for heat generated by the first package.