Semiconductor Package Thermal Conduction Path for Antenna Clearance
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Solution Overview
Problem
Sophisticated semiconductor devices are prone to performance degradation and potential failure due to excessive heat accumulation, necessitating effective thermal dissipation solutions.
Innovation Solution
A semiconductor device package design featuring an external thermal conductive structure with a die pad and limb portions extending over the substrate, forming a thermal conduction path to a printed circuit board, while maintaining an unobstructed top surface for antenna functionality and other features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal dissipation structure is added to the package, then heat dissipation capability is improved, but package complexity increases
Solution Approach 1:
The patent combines the thermal dissipation function with the package substrate structure itself. The external thermal conductive structure is integrated into the package substrate, merging the heat dissipation pathway with the structural support element, thereby improving heat dissipation without proportionally increasing overall package complexity
Solution Approach 2:
The package substrate serves multiple functions: it provides structural support, electrical interconnection, and thermal dissipation pathways. The external thermal conductive structure acts as both a thermal management component and a structural element of the package, achieving multi-functionality that reduces the need for separate dedicated thermal components
2Temperature
If thermal conductive structures are placed on the package substrate, then thermal conduction path is improved, but available space for other features is reduced
Solution Approach 1:
The thermal conductive structures extend in multiple dimensions across the package substrate, utilizing both planar areas and vertical thickness. The external thermal conductive structure extends laterally from the die pad across the substrate, efficiently utilizing available two-dimensional space while maintaining effective thermal conduction pathways without blocking entire regions
3Adaptability or versatility
If the top surface of the package is used for antenna structure, then radio signal propagation is enabled, but thermal dissipation path is obstructed
Solution Approach 1:
The thermal dissipation function is segmented from the top surface of the package and relocated to the bottom surface. The external thermal conductive structure provides thermal pathways through the substrate and exits at the bottom, separating the thermal management domain from the antenna domain, allowing both to coexist without interference
Solution Approach 2:
Instead of providing thermal dissipation through the top surface where the antenna is located, the patent inverts the approach by providing thermal dissipation through the bottom surface of the package. The external thermal conductive structure conducts heat away through alternative pathways that do not interfere with the antenna's radio signal propagation function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation at the bottom surface while allowing radio signal propagation and integration of additional features, thereby protecting sensitive circuitry from excessive heat.
Implementation Method 1
The thermal conductive structure forms a thermal conduction path between the semiconductor die and the printed circuit board
Data Source
AI summary
A semiconductor device package having a thermal dissipation feature is provided. The semiconductor device package includes a package substrate. A semiconductor die is mounted on a first surface of the package substrate. A thermal conductive structure including a die pad portion is affixed to the semiconductor die. A limb portion of the thermal conductive structure extends laterally away from the die pad portion and overlaps a portion of the package substrate. A thermal conduction path is formed between the semiconductor die and a distal end of the limb portion.