Semiconductor Package Thermal Structures for Waste-Heat Power and Cooling
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Solution Overview
Problem
As semiconductor components become more densely integrated, heat dissipation becomes a significant challenge, affecting the performance and reliability of electronic devices.
Innovation Solution
Integrating thermoelectric (TE) components as both thermoelectric generators (TEGs) and thermoelectric coolers (TECs) within semiconductor packages to manage heat by generating electrical power from waste heat and providing cooling, allowing for flexible thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integration density is increased by reducing minimum feature size, then more components can be integrated into a given area, but heat dissipation becomes more difficult
Solution Approach 1:
The patent converts waste heat, which is a harmful byproduct of high-density integration, into useful electrical energy through thermoelectric generators. This resolves the contradiction by transforming the heat dissipation problem into a power generation opportunity, allowing high integration density while managing thermal issues constructively
Solution Approach 2:
The patent changes the thermal parameters of the system by introducing thermoelectric materials with specific Seebeck coefficients and electrical conductivities. These parameter changes enable simultaneous achievement of high integration density and effective heat management through thermoelectric power generation
2Temperature
If thermoelectric components are integrated for thermal management, then temperature control improves, but device complexity increases
Solution Approach 1:
The patent implements multi-functionality by integrating thermoelectric components that simultaneously serve as power generators and temperature controllers. This universal approach allows a single component to address multiple thermal management needs, improving temperature control without proportionally increasing device complexity
Solution Approach 2:
The patent merges the functions of power generation and thermal management into integrated thermoelectric modules. By combining these functions in a single integrated structure rather than separate components, the system achieves effective temperature control with minimized additional complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves thermal stability and efficiency by converting waste heat into electricity, reducing energy consumption, and enhancing temperature control of temperature-sensitive components within semiconductor packages.
Implementation Method 1
In accordance with some embodiments, a thermoelectric (TE) component may be operated as a thermoelectric generator (TEG) to generate electrical power from the waste heat
Implementation Method 2
When operated as a TEC, an electrical current flowing through the TE component allows the TE component to transfer heat from one side of the TE component to the opposite side of the TE component
Data Source
AI summary
A method includes forming a first thermoelectric component on a first die; forming a second thermoelectric component on a second die; and connecting the first die and the second die to an interposer, wherein connecting the first die and the second die to the interposer electrically couples the first thermoelectric component and the second thermoelectric component to the interposer.