Package structure and method for manufacturing the same
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Solution Overview
Problem
Window Ball Grid Array (WBGA) packages are unable to transmit high-frequency signals due to limitations in their electrical connection methods, specifically the wire-bonding process which is cost-effective but inefficient for high-frequency signal transmission.
Innovation Solution
The package structure incorporates a first and second substrate with patterned circuit layers that extend beyond through holes to electrically connect electronic components, allowing for improved signal transmission by using extending portions of the patterned circuit layers to connect the components both within and outside the substrates, enabling efficient high-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire-bonding process is used for electrical connection, then manufacturing cost is reduced, but high-frequency signal transmission capability is lost
Solution Approach 1:
The patent extracts the wire-bonding process from the electrical connection method and replaces it with patterned circuit layers. The circuit layers are formed directly on the substrate through standard PCB fabrication processes, eliminating the need for separate wire-bonding operations while maintaining electrical connectivity.
Solution Approach 2:
The patent replaces the mechanical wire-bonding system with an integrated circuit layer system. Instead of using physical wires bonded to component leads, the electrical connections are achieved through conductive traces patterned on the substrate, which inherently support high-frequency signals due to their controlled impedance and continuous ground references.
2Reliability
If patterned circuit layers with extending portions are used, then high-frequency signal transmission is enabled, but manufacturing complexity increases
Solution Approach 1:
The patent merges the electrical connection function with the substrate structure itself. The patterned circuit layers are integrated into the substrate during its fabrication process, combining what would traditionally be separate components (substrate and interconnect structure) into a single unified element.
Solution Approach 2:
The patterned circuit layers serve multiple functions: they provide electrical connectivity, establish controlled impedance for high-frequency signals, provide grounding references, and define the mechanical mounting structure for electronic components. This multi-functionality reduces the need for additional specialized structures.
3Reliability
If circuit layers extend beyond substrate sidewalls, then electrical connection reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary action by forming the patterned circuit layers with extending portions during the substrate fabrication process, before component mounting. The extending portions are pre-positioned and connected to internal circuitry through vias and conductive structures, ensuring alignment is established during manufacturing rather than during assembly.
Solution Approach 2:
The extending portions of the circuit layers act as intermediaries between the internal substrate circuitry and the external electronic components. These extending portions provide a transition zone that facilitates reliable electrical connection while accommodating tolerances in component placement through their extended reach and flexible routing.
Data Source
AI summary
A package structure and a method of manufacturing a package structure are provided. The package structure includes a first substrate, a first electronic component, a second substrate and a second electronic component. The first electronic component is disposed over a first through hole of the first substrate. The first electronic component is electrically connected to a first patterned circuit layer of the first substrate through an extending portion of the first patterned circuit layer extending beyond a sidewall of the first through hole. The second electronic component is disposed over a second through hole of the second substrate. The second electronic component is electrically connected to a second patterned circuit layer of the second substrate through an inner extending portion of the second patterned circuit layer extending beyond a sidewall of the second through hole.