Semiconductor Package TIM Structure for Heat and Delamination
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Solution Overview
Problem
Integrated circuit packages experience warpage and increased heat generation due to material differences and power density requirements, leading to stress and delamination issues.
Innovation Solution
The use of multiple Thermal Interface Materials (TIMs) with varying materials to distribute stress and maintain high thermal dissipation, combined with a phase-change material and liquid metal TIM for enhanced thermal conductivity and delamination resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple Thermal Interface Materials (TIMs) with varying materials are used, then stress distribution and delamination resistance are improved, but device complexity increases
Solution Approach 1:
The patent divides the thermal interface material into multiple discrete TIM layers with different material compositions. Each TIM layer is positioned between specific package components to address localized stress and thermal requirements, transforming a single homogeneous material into a segmented multi-material structure that reduces delamination risk while managing complexity through functional zoning
Solution Approach 2:
The patent employs composite material construction by combining multiple TIM materials with different properties (thermal conductivity, compliance, CTE) into a layered thermal interface system. This composite approach allows optimization of both stress distribution and heat dissipation by selecting materials whose properties complement each other, achieving enhanced reliability through material diversity rather than complexity
2Adaptability or versatility
If package size increases to increase functionality and integration level, then device functionality is improved, but warpage becomes more severe
Solution Approach 1:
The patent applies local quality by positioning specific TIM materials at critical interfaces within the package structure where stress concentration occurs. Rather than uniformly treating the entire package, the solution targets specific locations (between die and substrate, between interposers and substrates) with materials optimized for local stress management, allowing large package sizes to be maintained without excessive warpage
Solution Approach 2:
The patent changes material parameters (thermal conductivity, compliance, coefficient of thermal expansion) of the TIM layers to compensate for warpage in larger packages. By selecting TIM materials with appropriate CTE matching and compliance properties, the system accommodates thermal expansion differences in enlarged packages, maintaining planarity and reducing warpage while preserving enhanced functionality
3Power
If power density requirements increase to meet performance demands, then device performance is improved, but heat generation increases
Solution Approach 1:
The patent uses composite TIM materials with hierarchically structured properties: high thermal conductivity materials (such as metal-based TIMs) are positioned at critical heat transfer interfaces, while compliant polymer-based TIMs are used where stress management is prioritized. This composite material strategy enables high power density operation by ensuring efficient heat extraction through strategically selected material properties, preventing excessive temperature rise while maintaining performance
Solution Approach 2:
The TIM layers serve as thermal intermediaries between high-power generating components (die, interposers) and heat dissipation structures (substrates, heat sinks). These intermediary materials facilitate efficient thermal energy transfer from concentrated heat sources to larger heat dissipation areas, managing the temperature increase that results from high power density requirements while preserving device performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces delamination risk while maintaining high thermal dissipation, improving the durability and performance of integrated circuit packages under temperature cycles.
Implementation Method 1
the clamping process causes the boundary layer material to change from a solid to a liquid state, so that the boundary layer material spreads to cover the package component and bond to adjacent surfaces
Implementation Method 2
a metal thermal interface material (TIM) layer surrounded by the boundary structure
Data Source
AI summary
Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes a package component with one or more integrated circuits adhered to a package substrate, a hybrid thermal interface material utilizing a combination of polymer based material with high elongation values and metal based material with high thermal conductivity values. The polymer based thermal interface material placed on the edge of the package component contains the metal based thermal interface material in liquid form.