Electronic Device Package Top-Side Test Interface

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current system-in-package (SIP) testing solutions face issues with performance and signal modification due to adapter circuitry, risk of damaging packages during testing, and difficult access for testing due to adapter placement on bottom sides and lateral sides, leading to uncertain test results and adapter wear.

Innovation Solution

Integration of a test interface within the electronic device package, accessible on the top side, eliminating the need for external adapters like interposers or test socket boards, with connectors providing direct signal and power for testing electronic components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external adapters (interposers or test socket boards) are used for testing, then electrical coupling with electronic components is achieved, but signal modification and performance degradation occur due to adapter circuitry

Engineering Contradiction:

Improvetest result accuracyVSAvoidadapter circuitry

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the external adapter (interposer or test socket board) from the testing system. By integrating the test interface directly into the package substrate, the solution removes the problematic adapter circuitry that caused signal modification and performance degradation, while maintaining the essential electrical coupling function between testing equipment and electronic components.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the test interface functionality directly into the package substrate, combining what were previously separate components (adapter and package) into a single integrated structure. This eliminates the interface between adapter and package that caused signal issues, while preserving all necessary electrical connections for component testing.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of operation

If adapters are placed on bottom sides and lateral sides of packages, then electrical coupling for testing is achieved, but access for testing becomes difficult

Engineering Contradiction:

Improvetesting accessibilityVSAvoidadapter placement configuration

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The patent inverts the conventional adapter placement approach by positioning the test interface on the top side of the package instead of the bottom or lateral sides. This reversal makes the test interface easily accessible from above, eliminating the difficulty of accessing adapters positioned on the bottom or sides of packages.

Inventive Principle:

Principle #13The other way round (Inversion)

3Reliability

If external adapters are used for testing, then electrical coupling with electronic components is achieved, but packages may be damaged during testing

Engineering Contradiction:

Improvepackage integrityVSAvoidadapter interface structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and removes the external adapter component that posed a risk of damaging packages during testing. By integrating the test interface directly into the package substrate, the solution eliminates the mechanical interface between separate adapter and package components, thereby removing the source of potential damage while maintaining electrical coupling functionality.

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If adapters are used for testing, then electrical coupling is achieved, but adapter wear occurs leading to uncertain test results

Engineering Contradiction:

Improvetest result consistencyVSAvoidadapter service life

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The patent merges the test interface functionality into the package substrate itself, eliminating the separate adapter component that subject to wear. This integration ensures that the testing interface has the same service life as the package, eliminating the reliability issues caused by adapter degradation from repeated use.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10393799B2Electronic device package

Publication Date: 2019.08.27 INTEL CORP

AI summary

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a substrate. The electronic device package can also include an electronic component disposed on the substrate and electrically coupled to the substrate. The electronic device package can further include a connector disposed on the substrate and electrically coupled to the substrate for communication with the electronic component. The connector can have a contact to interface with a mating connector and configured to provide a signal and/or power to the electronic component to facilitate testing the electronic component. Additionally, the electronic component can include an encapsulant material disposed on the substrate and at least partially encapsulating the electronic component and/or the connector. The contact can be accessible on a top side of the electronic device package to facilitate coupling the connector to a testing device. Associated systems and methods are also disclosed.