Semiconductor Package Power Conversion With In-Package Transformer
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Solution Overview
Problem
Large semiconductor devices require high current at low voltages, posing challenges for packaging technologies in terms of power, thermal, and signal management, particularly due to space constraints and thermal management limitations in electronic systems.
Innovation Solution
A method and apparatus for supplying power to semiconductor chips using a driver circuit outside the package, with a power transformer and rectification circuit inside, employing a series of converter operating cycles with equal power transfer phases and a power bus to deliver DC power, along with inductive components and switch controllers for efficient power conversion, and incorporating magnetically permeable cores for improved efficiency and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high current at low voltage is supplied to large semiconductor devices, then the power delivery capability is improved, but the packaging complexity and thermal management difficulty increase
Solution Approach 1:
The power conversion system is divided into separate functional modules: a driver circuit operating outside the semiconductor package and output circuits integrated within the package. This segmentation allows the complex high-current power conversion function to be distributed, reducing the packaging complexity while maintaining high power delivery capability to the semiconductor devices
Solution Approach 2:
A transformer is introduced as an intermediary component between the driver circuit and the semiconductor package. The transformer enables galvanic isolation and voltage transformation, allowing the driver circuit to operate at higher voltages while delivering high current at low voltage to the semiconductor devices, thereby simplifying the overall packaging structure
2Power
If high current at low voltage is supplied to large semiconductor devices, then the power delivery capability is improved, but the thermal dissipation requirements increase
Solution Approach 1:
The driver circuit, which generates significant heat during operation, is extracted from the semiconductor package and placed outside. This separation removes the primary heat-generating component from the thermal management burden of the package, allowing the package to focus on cooling the semiconductor devices while the driver circuit's thermal requirements are managed independently
Solution Approach 2:
The system transitions from direct low-voltage DC power delivery to a multi-dimensional approach using high-frequency AC power transmission through the transformer. This enables power to be delivered in a different dimensional space (high-frequency AC domain) and then converted to the required low-voltage DC, improving thermal management efficiency
3Loss of energy
If converter operating cycles with equal power transfer phases are used, then the converter efficiency is improved, but the circuit complexity increases
Solution Approach 1:
The converter operates in periodic cycles with distinct power transfer phases, where switches are turned ON and OFF in a regular pattern. This periodic operation enables resonant power transfer through the transformer, improving converter efficiency by minimizing energy losses while the switching control logic manages the circuit complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient power delivery to high current, low voltage loads while reducing space and thermal dissipation requirements, improving converter efficiency and noise management, and effectively addressing the challenges of signal and power demands in semiconductor packaging.
Implementation Method 1
a power transformer including a first winding and a second winding, an input connected to the first winding for receiving AC power from the driver output
Implementation Method 2
a rectification circuit connected to the second winding for rectifying power received from the transformer
Implementation Method 3
incorporating magnetically permeable cores for improved efficiency and noise reduction
Data Source
AI summary
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.