Semiconductor Package Transport for Low-Latency Data Storage
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Solution Overview
Problem
Current storage systems, such as solid state drives (SSDs), face challenges in efficiently managing and accessing large amounts of data in data centers due to limitations in read/write speeds and storage media configurations, leading to increased latency and costs.
Innovation Solution
A storage system comprising a package stocker, a drive, and a host apparatus, where semiconductor packages with nonvolatile memory dies are detachably mounted on sockets, allowing for efficient transport and prioritization to optimize data access and processing, utilizing a package transport device to rapidly move packages between the stocker and drive, reducing physical head movement and latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If semiconductor packages are detachably mounted on sockets with package transport device, then data access speed and I/O throughput are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The storage system is divided into multiple independent semiconductor packages that can be separately mounted on sockets. Each package contains specific data, allowing selective access without moving entire storage arrays. The package transport device moves only required packages between stocker and drive, reducing access time and improving data retrieval speed.
Solution Approach 2:
Semiconductor packages are pre-mounted on sockets in the drive unit before data access is required. The package transport device proactively moves packages from the stocker to the drive based on predicted or scheduled data access patterns, so that when data access is needed, the packages are already in position, eliminating wait time.
2Quantity of substance
If large amounts of data are stored in data centers, then storage capacity is improved, but latency and access time increase
Solution Approach 1:
Large storage capacity is achieved by using multiple semiconductor packages, each storing a portion of the total data. When data access is required, only the specific package containing the needed data is transported and accessed, rather than scanning through entire storage arrays. This segmentation reduces access latency significantly while maintaining high storage capacity.
Solution Approach 2:
The system optimizes local data access by keeping frequently accessed data in semiconductor packages that are readily available in the drive unit. Less frequently accessed data remains in the stocker. The package transport device dynamically adjusts which packages are active in the drive versus stored in the stocker, creating local optimization that reduces average access latency across the entire storage system.
3Loss of time
If physical head movement is reduced in storage systems, then access latency is improved, but device complexity increases
Solution Approach 1:
The system replaces the traditional mechanical head movement mechanism with a package-level transport system. Instead of moving read/write heads across large storage arrays, the package transport device moves entire semiconductor packages to positioned sockets. This substitution eliminates the need for high-speed mechanical head positioning while reducing access latency through direct package-to-socket mounting.
Data Source
AI summary
According to one embodiment, a package stocker is configured to store a plurality of semiconductor packages each including one or more nonvolatile memory dies. A drive includes at least one socket on which a semiconductor package is able to be detachably mounted. A host apparatus, which is communicatively connected to the drive, reads/writes data from/to the one or more nonvolatile memory dies of the semiconductor package mounted on the socket. When a first semiconductor package is not mounted on the socket, the host apparatus causes a package transport device to transport the first semiconductor package to the drive and to mount the first semiconductor package on the socket.