Package Substrate Vertical Cooling Channels for Hotspot Relief
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Solution Overview
Problem
As integrated circuit packages become more complex, effectively removing heat from these devices becomes challenging due to the presence of multiple layers, which can lead to localized hotspots and reduced performance, especially when using glass-based cores with low thermal conductivity.
Innovation Solution
Incorporating vertical cooling channels within the package substrate, which connect microchannels and heat pipes across different layers, and coating these channels with a hydrophilic material to enhance cooling performance by preventing vapor layer formation at the Leidenfrost temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass-based cores are used in package substrates, then substrate rigidity is improved, but thermal conductivity deteriorates leading to localized hotspots
Solution Approach 1:
The cooling system is segmented into multiple microchannels distributed across different layers of the package substrate. Each microchannel independently removes heat from specific regions, preventing localized hotspots while maintaining the glass-based core structure for rigidity.
Solution Approach 2:
The cooling architecture transitions from planar cooling to three-dimensional vertical cooling by stacking microchannels across multiple layers. This vertical arrangement allows heat to be removed from different depths of the package substrate, addressing thermal issues in the glass-based core without compromising structural integrity.
2Adaptability or versatility
If multiple layers are added to package substrates, then device functionality is improved, but heat removal becomes more difficult
Solution Approach 1:
The patent implements vertical microchannels that extend through multiple layers of the package substrate, creating a three-dimensional cooling network. This allows heat to be efficiently removed from deep within the multi-layer structure without adding horizontal complexity that would compromise device functionality.
Solution Approach 2:
The cooling system is nested within the multi-layer package substrate structure, with microchannels integrated into the vertical stack. The channels are positioned within and between functional layers, allowing simultaneous heat removal and device operation without interference.
3Temperature
If cooling channels are added to package substrates, then heat removal is improved, but device complexity increases
Solution Approach 1:
The vertical microchannels serve multiple functions: they provide thermal management pathways, act as structural support elements, and can be integrated with existing package substrate manufacturing processes. This multi-functionality reduces the need for separate cooling components, thereby limiting complexity increases.
4Temperature
If cooling channels are coated with hydrophilic material, then cooling performance at high temperature is improved, but manufacturing complexity increases
Solution Approach 1:
The hydrophilic coating is applied to the cooling channels during the manufacturing process before the channels are sealed and filled with coolant. This preliminary action ensures proper coating distribution and eliminates the need for post-manufacturing intervention, thereby limiting the increase in manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively redistributes heat across layers, alleviates localized hotspots, and improves overall device performance by maintaining efficient cooling even at high temperatures, thereby enhancing the thermal management of complex integrated circuit packages.
Implementation Method 1
coating these channels with a hydrophilic material to enhance cooling performance by preventing vapor layer formation at the Leidenfrost temperature
Implementation Method 2
The vertical channels may accordingly act to redistribute heat quickly and efficiently between the different layers of the substrate
Data Source
AI summary
In one embodiment, an integrated circuit package substrate includes a core layer and a plurality of build-up layers on the core layer, each build-up layer comprising a dielectric and metal. The package substrate also includes a cavity, wherein a first portion of the cavity is defined in a first build-up layer, a second portion of the cavity is defined in a second build-up layer, and a third portion of the cavity connects the first portion with the second portion through at least one layer other than first build-up layer and the second build-up layer.