Mechanically Punched Package Vias to Prevent Adhesive Encroachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for forming vias in semiconductor packaging, such as laser drilling or mechanical punching, face limitations in throughput and adhesive encroachment, particularly when punching through both the dielectric layer and adhesive layer, leading to reduced reliability and performance.
Innovation Solution
Mechanical punching of vias through both the electrically insulating substrate and adhesive layer from the substrate side, with the substrate forming a protrusion to cover part of the adhesive layer, preventing adhesive encroachment and enhancing via formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical punching is used to form vias through both dielectric layer and adhesive layer, then throughput is improved, but adhesive encroachment into vias occurs reducing reliability
Solution Approach 1:
The via formation process is segmented into two distinct operations: first punching through the dielectric layer only, then separately punching through the adhesive layer. This segmentation prevents adhesive contamination during the primary via formation while maintaining high throughput through automated multi-step processing.
Solution Approach 2:
The dielectric layer is punched first to create the via cavity before the adhesive layer is applied and subsequently punched. This preliminary action ensures that the via path is established free of adhesive contamination, and the adhesive layer punching is performed as a separate, controlled operation that does not compromise via cleanliness.
2Manufacturing precision
If laser drilling is used to form vias, then via quality is improved, but throughput is reduced
Solution Approach 1:
The patent replaces laser drilling with mechanical punching operations for via formation. Mechanical punching provides sufficient via quality for metal interconnect formation while achieving significantly higher throughput rates, as mechanical processes can be performed faster and in parallel compared to sequential laser drilling operations.
Solution Approach 2:
The invention changes the processing parameters by using mechanical force instead of thermal energy for via formation. This parameter change from thermal (laser) to mechanical (punching) enables faster processing speeds while maintaining adequate via dimensions and shape for subsequent metal plating operations.
3Ease of manufacture
If via diameter is increased for mechanical punching, then ease of manufacture is improved, but applicability to smaller features is reduced
Solution Approach 1:
The patent employs dynamic, adjustable punching tools with variable diameter tips that can be changed or selected based on the required via size. This dynamic capability allows the same mechanical punching system to handle a wide range of via diameters, from large power vias to smaller signal vias, maintaining ease of manufacture across different feature sizes.
Solution Approach 2:
The mechanical punching system is designed as a universal tool that can form vias of various diameters and in different layer configurations (dielectric only, or dielectric plus adhesive). The system's multi-functionality allows it to handle both large-diameter power vias and smaller-diameter signal vias, as well as different via depths, within a single manufacturing platform.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases throughput and reliability by preventing adhesive encroachment and ensuring consistent via shape, improving the robustness and reliability of metal connections in semiconductor packaging.
Implementation Method 1
forming one or more vias through the electrically insulating substrate and the adhesive layer by mechanically punching the one or more vias through the electrically insulating substrate and the adhesive layer
Data Source
AI summary
An electronics package includes an electrically insulating substrate having a first surface and a second surface, an adhesive layer positioned on the first surface of the electrically insulating substrate, and an electrical component having a top surface coupled to the adhesive layer on a surface thereof opposite the electrically insulating substrate, the electrical component having contact pads on the top surface. Vias are formed through the electrically insulating substrate and the adhesive layer at locations corresponding to the contact pads by way of a mechanical punching operation, with each of the vias having a via wall extending from the second surface of the electrically insulating substrate to a respective contact pad. At each via, the electrically insulating substrate comprises a protrusion extending outwardly from the first surface thereof so as to cover at least part of the adhesive layer in forming part of the via wall.