Semiconductor Package Wall Layout for Unsealed Gas Venting
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Solution Overview
Problem
Conventional electronic devices often become sealed during manufacturing due to fixing agents penetrating into gaps, preventing gas circulation between internal and external spaces, which can lead to pollution issues.
Innovation Solution
An electronic device design featuring a substrate with a semiconductor unit, a wall with exterior and interior components, and a light-transmitting member, where the gaps between exterior wall components are in spatial communication with an installation area, allowing gas circulation while the interior components shade these gaps to prevent pollution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a gap is provided on the upper surface to ensure gas circulation, then gas circulation between internal and external spaces is improved, but fixing agents penetrate into the gap during manufacturing, causing the device to become sealed
Solution Approach 1:
The wall is divided into multiple segments including exterior wall components and interior wall components. The interior wall components are positioned to shade specific regions of the gaps, creating segmented functional zones within the gap structure that allow gas circulation while blocking fixing agent penetration.
Solution Approach 2:
Different portions of the wall structure have different functions: exterior wall components provide structural support and define the gap, while interior wall components provide selective shading to block fixing agents. This local differentiation of properties allows the same gap structure to serve multiple purposes.
2Reliability
If the device is kept in an unsealed state for gas circulation, then gas circulation is improved, but pollution enters the internal space
Solution Approach 1:
The wall structure is segmented into exterior and interior components that create distinct functional zones. The interior wall components shade specific portions of the gaps, segmenting the gas flow path into a tortuous channel that allows circulation while blocking direct pollution entry.
Solution Approach 2:
The shading arrangement of interior wall components creates a tortuous (curved/irregular) gas channel rather than a straight path. This curved configuration increases the complexity of the gas flow path, allowing gas circulation while making it difficult for pollution to directly enter the internal space.
3Object-affected harmful factors
If interior wall components are added to shade the gaps, then pollution blocking is improved, but device complexity increases
Solution Approach 1:
The interior wall components serve multiple functions simultaneously: they provide structural support, define the gap geometry, shade specific regions to block fixing agents, and create the tortuous gas channel configuration. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The exterior and interior wall components are merged into a single integrated wall structure that performs multiple functions. The combination of these components creates a unified structure that provides both structural support and pollution blocking without requiring separate systems.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a semiconductor unit, a wall, and a light-transmitting member. The semiconductor unit is mounted on the substrate. The wall is disposed on the substrate and surrounds the semiconductor unit. The wall includes two exterior wall components and two interior wall components. The two exterior wall components are spaced apart from each other, so that two gaps are formed between the two exterior wall components. The two gaps are in spatial communication with an installation area that is surrounded by the two exterior wall components. The two interior wall components are arranged in the installation area and spaced apart from each other. The two interior wall components correspond in position to the two gaps and respectively shade parts of the two gaps. The light-transmitting member is disposed on the wall and covered on the semiconductor unit.