Electronic Component Package Warpage Reduction via Additional Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of electronic components leads to intensified warpage phenomena in high-temperature environments, causing connectivity issues and cracks in electronic component packages, which existing technologies struggle to address effectively.
Innovation Solution
An electronic component package is designed with an additional layer on the surface of the molding part or active element, made of materials with specific thermal expansion coefficients and thicknesses, to mitigate warpage. This layer can have a coefficient of thermal expansion of 15×10−6/°C or more, or less than 15×10−6/°C, with a thickness of 0.01 to 0.3 mm, and can be made of silicon dioxide, applied using methods like coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package is miniaturized and slimmed, then the size and thickness are reduced, but the warpage phenomenon is intensified
Solution Approach 1:
The patent applies parameter changes by carefully selecting and controlling the coefficient of thermal expansion (CTE) of the molding compound and additional layers. By adjusting the CTE parameters of different materials in the package structure, the patent compensates for thermal expansion differences that cause warpage, thereby maintaining package stability despite miniaturization and slimming.
Solution Approach 2:
The patent uses composite materials by incorporating additional layers with specific CTE values between the substrate and the active element. These intermediate layers are made from materials with carefully selected thermal expansion properties that differ from both the substrate and the active element, creating a composite structure that balances thermal stresses and reduces warpage in the miniaturized package.
2Productivity
If the molding part is made using EMC, then the manufacturing process efficiency is improved, but the warpage phenomenon intensifies in high temperature environment
Solution Approach 1:
The patent introduces additional layers as intermediary elements between the substrate and the active element covered by the EMC molding part. These intermediate layers act as mediators that buffer thermal expansion stresses, preventing direct stress transmission that would cause connectivity issues or cracks, thereby maintaining reliability while preserving the manufacturing efficiency benefits of EMC molding.
Solution Approach 2:
The patent modifies the thermal expansion parameters of the package structure by selecting molding compounds and additional layers with specific CTE values. By changing these material parameters, the patent reduces the overall thermal stress in the package during high-temperature operations, preventing connectivity deterioration and crack generation while maintaining the productivity advantages of standard EMC molding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The additional layer significantly reduces warpage values to zero or more, enhancing manufacturing efficiency and reliability by matching thermal expansion coefficients, thereby improving connectivity and reducing the risk of cracks.
Implementation Method 1
the additional layer may be made of a material having a coefficient of thermal expansion of 15×10−6/° C. or more
Data Source
AI summary
Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.