Semiconductor Package Structure With Warpage-Control Element Anchoring
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Solution Overview
Problem
New packaging technologies for semiconductor dies face manufacturing challenges in achieving higher density and functionality while maintaining reliable surface mount connections and controlling warpage in smaller package structures.
Innovation Solution
A package structure is formed with a circuit substrate carrying one or more dies, incorporating a warpage-control element with protruding portions that extend into the substrate to improve adhesion and reduce warpage, along with a redistribution structure and underfill material to enhance surface mount connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package structures are made smaller to increase density, then space efficiency is improved, but warpage control and surface mount connection reliability deteriorate
Solution Approach 1:
The package structure is segmented into distinct functional layers including a substrate layer, a warpage control layer with protruding portions, and a die attach layer. This segmentation allows each layer to independently address specific challenges: the substrate provides mounting functionality, the warpage control layer actively manages thermal expansion and mechanical stress, and the die attach layer ensures reliable electrical connections, thereby maintaining reliability in smaller packages
Solution Approach 2:
The warpage control layer incorporates protruding portions with specific geometric parameters (height, width, spacing) that are optimized to counteract thermal expansion and mechanical stress. By adjusting these parameters, the structure can be tuned to maintain flatness and control warpage across different package sizes, enabling reliable surface mount connections even in compact designs
2Volume of moving object
If package structures are made smaller to increase density, then space efficiency is improved, but warpage control deteriorates
Solution Approach 1:
The warpage control layer uses protruding portions with carefully controlled geometric parameters including height (h), width (w), and spacing (s) that are specifically designed to counteract thermal expansion and mechanical stress. These parameters can be adjusted based on package size requirements, allowing the same structural concept to maintain effective warpage control across different scaling dimensions
Solution Approach 2:
The package structure employs a composite design combining a substrate material (e.g., PCB or ceramic) with a warpage control layer made of materials having different coefficients of thermal expansion. This composite structure creates a balanced system where the differential expansion between layers is harnessed to actively counteract warpage, providing stable composition control in smaller packages
3Strength
If warpage-control element protruding portions extend into the substrate, then adhesion is improved, but device complexity increases
Solution Approach 1:
The warpage control layer is segmented into multiple protruding portions distributed across the substrate surface, with each portion serving as an independent adhesion anchor. This segmentation provides multiple discrete bonding points that collectively enhance overall adhesion strength while maintaining a relatively simple overall structure that can be manufactured using standard layering techniques
Solution Approach 2:
The protruding portions of the warpage control layer are formed in advance during the substrate fabrication process, before die attachment and final packaging. This preliminary formation of adhesion-enhancing features simplifies subsequent assembly steps, as the adhesion structure is already in place and does not require additional complex processing operations
Data Source
AI summary
A package structure is provided. The package structure includes a substrate and a chip-containing structure over the substrate. The package structure also includes a warpage-control element laterally surrounding the chip-containing structure. The warpage-control element has a protruding portions extending into the substrate.