Semiconductor Package Structure With Warpage Control Material
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving efficient packaging of integrated circuit dies due to thermal expansion coefficient (CTE) mismatch, leading to warpage issues during the packaging process, which affects the reliability and performance of device packages.
Innovation Solution
The use of a warpage control material with a specific CTE and Young's Modulus, applied in conjunction with a protection material, to manage CTE mismatch and reduce warpage, along with a method involving conductive pillars, encapsulants, and redistribution structures in the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If integrated circuit dies are packaged with conventional materials, then the packaging process is simple, but thermal expansion coefficient mismatch causes warpage issues affecting reliability
Solution Approach 1:
The patent introduces a buffer layer as an intermediary material between the integrated circuit die and the encapsulant. This buffer layer has a thermal expansion coefficient positioned between that of the die and the encapsulant, acting as a mediator to gradually transition the thermal expansion properties and reduce the abrupt mismatch that causes warpage, thereby improving package reliability without requiring complex packaging structures
Solution Approach 2:
The patent changes the thermal expansion parameter by selecting materials with specific thermal expansion coefficients for different layers. The buffer layer is specifically chosen to have a thermal expansion coefficient that is greater than that of the integrated circuit die but less than that of the encapsulant, creating a gradient that compensates for differential thermal expansion and prevents warpage during temperature cycling, thus enhancing reliability
2Productivity
If smaller feature sizes are used to increase integration density, then more components can be integrated, but packaging challenges and warpage issues increase
Solution Approach 1:
The patent addresses the reliability challenges of high-density integration by changing the material parameters, specifically the thermal expansion coefficients, of the packaging layers. The buffer layer is designed with intermediate thermal expansion properties to compensate for the increased stress and warpage susceptibility that arises when smaller feature sizes and higher integration densities are used, thereby maintaining package reliability despite increased productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces warpage and enhances the reliability of device packages by managing thermal expansion and mechanical stress, improving the integration and performance of integrated circuit dies.
Implementation Method 1
thermal expansion coefficient (CTE) mismatch, leading to warpage issues during the packaging process
Implementation Method 2
Young's modulus of the warpage control material is greater than a Young's modulus of the encapsulant
Data Source
AI summary
Provided is a package structure, including a die, a plurality of through vias, an encapsulant, a plurality of first connectors, a warpage control material and a protection material. The plurality of through vias are disposed around the die. The encapsulant laterally encapsulate the die and the plurality of through vias. The plurality of first connectors are electrically connected to a first surface of the plurality of through vias. The warpage control material is disposed over a first surface of the die. The protection material is disposed over the encapsulant, around the plurality of first connectors and the warpage control material. A Young's modulus of the warpage control material is greater than a Young's modulus of the encapsulant, and the Young's modulus of the encapsulant is greater than a Young's modulus of the protection material.