Packaged Antenna Circuit Structure with Shielding Layer for 5G Interference
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Solution Overview
Problem
The 5th generation wireless standard requires more components to be integrated into antenna modules, leading to significant electromagnetic interference and heat issues unless the antenna module is improved.
Innovation Solution
A packaged circuit structure is manufactured using a shielding layer with conductive pillars, an electronic component fixed in a groove, and an antenna structure laminated on both sides, along with a heat sink for efficient heat dissipation, to mitigate electromagnetic interference and enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more components are integrated into the antenna module to meet 5th generation wireless standard requirements, then the functionality and performance of the antenna module is improved, but electromagnetic interference between components increases and heat generation becomes more severe
Solution Approach 1:
The antenna module is divided into multiple functional layers including signal transmission layer, shielding layer, and ground layer. Each layer serves a specific function to reduce electromagnetic interference while maintaining signal integrity. The shielding layer is segmented into multiple zones with different grounding strategies to effectively contain electromagnetic fields.
Solution Approach 2:
A dedicated shielding layer is introduced as an intermediary between different functional components to block electromagnetic interference. This shielding layer acts as a mediator that allows signal transmission while preventing harmful electromagnetic coupling between adjacent components.
2Adaptability or versatility
If more components are integrated into the antenna module to meet 5th generation wireless standard requirements, then the functionality and performance of the antenna module is improved, but heat generation becomes more severe
Solution Approach 1:
Heat dissipation is addressed by transitioning from two-dimensional component layout to three-dimensional thermal management. Multiple thermal vias are vertically distributed throughout the module, and heat dissipation pathways are established in the thickness direction, effectively managing heat generation from integrated components.
3Object-affected harmful factors
If shielding structures are added to reduce electromagnetic interference, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The shielding layer serves multiple functions simultaneously: it provides electromagnetic shielding, acts as a reference plane for signal transmission, and serves as a thermal management pathway. This multi-functionality reduces the need for separate dedicated structures, thereby limiting complexity increase.
4Object-affected harmful factors
If multiple layers and shielding structures are implemented, then electromagnetic interference is reduced and heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
Thermal via holes and shielding structures are pre-designed and pre-positioned during the PCB layout stage. Thermal via patterns are predetermined in critical heat-generating areas, and shielding layer configurations are established before component placement, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic interference and improves heat dissipation, ensuring the stability and efficiency of the antenna module for 5th generation wireless standards.
Implementation Method 1
heat sink for efficient heat dissipation
Implementation Method 2
heat sink for efficient heat dissipation
Implementation Method 3
shielding layer with conductive pillars
Data Source
AI summary
A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.