Packaged Board Thickness Uniformity via Two-Stage Sintering
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Solution Overview
Problem
Packaged boards often exhibit non-uniform thickness and quality instability due to variations in the sealing process using molding resin.
Innovation Solution
A method involving provisional sintering of molding resin at a low temperature, followed by detachment from the molding die and final sintering at a higher temperature while maintaining uniform thickness, using a pressing apparatus to ensure consistent thickness of the packaged board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding resin is supplied to molding dies and sintered at final sintering temperature, then the packaged board is sealed and formed, but the thickness becomes non-uniform and quality becomes unstable
Solution Approach 1:
The sintering process is divided into two distinct stages: provisional sintering at a lower temperature (first sintering temperature) to form a preliminary structure, and final sintering at a higher temperature (second sintering temperature) to complete the curing. This segmentation allows the molding resin to be processed in controlled steps, preventing thickness non-uniformity while ensuring complete sealing and quality stability.
Solution Approach 2:
The provisional sintering step is performed as a preliminary action before final sintering. During this preliminary stage, the molding resin is partially cured at a lower temperature to establish a stable thickness profile. This preliminary structuring prevents deformation during subsequent final sintering, ensuring both uniform thickness and quality stability.
2Reliability
If molding resin is sintered at high temperature to ensure complete curing, then sealing quality improves, but thickness uniformity deteriorates
Solution Approach 1:
The sintering process is divided into two distinct stages: provisional sintering at a lower temperature (first sintering temperature) to form a preliminary structure, and final sintering at a higher temperature (second sintering temperature) to complete the curing. This segmentation allows the molding resin to be processed in controlled steps, preventing thickness non-uniformity while ensuring complete sealing and quality stability.
Solution Approach 2:
The sintering temperature parameter is changed in two distinct steps: first to a lower temperature for provisional sintering to establish thickness uniformity, then to a higher temperature for final sintering to ensure complete curing and sealing quality. This parameter progression resolves the contradiction between achieving uniform thickness and complete curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures a packaged board with uniform thickness and improved quality by fully curing the molding resin, enhancing the stability and consistency of the packaging process.
Implementation Method 1
provisionally sintering the molding resin at a relatively low provisional sintering temperature below a final sintering temperature
Implementation Method 2
heating the wiring board at the final sintering temperature to finally sinter the provisionally sintered molding resin while keeping its thickness uniform
Data Source
AI summary
A method of manufacturing a packaged board includes the steps of blanketing a wiring board with devices disposed thereon in a molding die and supplying the molding resin to the molding die, provisionally sintering the molding resin at a relatively low provisional sintering temperature below a final sintering temperature, detaching the wiring board from the molding die, and thereafter, placing the wiring board on a first base having a first flat surface, pressing the wiring board with a second base having a second flat surface parallel to the first flat surface, and heating the wiring board at the final sintering temperature to finally sinter the provisionally sintered molding resin while keeping its thickness uniform.