High-Efficiency Packaged Chip Structure With Solder Bonding
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Solution Overview
Problem
The demand for high-frequency, high-power semiconductor devices, particularly in 5G communication and electric vehicle industries, requires efficient packaging solutions that current chip-on-board approaches struggle to meet, especially in terms of mechanical strength and electrical performance.
Innovation Solution
A chip structure comprising a substrate with a core layer and composite material, a bottom conductive layer, semiconductor layer, interlayer dielectric layer, and top electrodes, along with a packaging method using solder to securely attach the chip to a circuit board, enhancing mechanical strength and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chip-on-board approach with polymer adhesive is used, then ease of manufacture is improved, but mechanical strength and electrical performance deteriorate
Solution Approach 1:
The patent changes the bonding parameter from polymer adhesive to solder material, transforming the bonding mechanism from adhesive bonding to metallurgical bonding. This parameter change simultaneously improves mechanical strength through strong solder joints while maintaining manufacturing feasibility through standardized soldering processes
Solution Approach 2:
The patent employs composite material structures including substrate combinations (e.g., ceramic-substrate, metal-substrate), multi-layer conductor patterns, and integrated semiconductor devices. These composite structures enhance overall mechanical strength and electrical performance while enabling efficient heat dissipation pathways
2Ease of manufacture
If chip-on-board approach with polymer adhesive is used, then ease of manufacture is improved, but electrical performance deteriorates
Solution Approach 1:
The patent changes the electrical bonding parameter from polymer adhesive (insulator) to solder material (conductor), fundamentally improving electrical connectivity. The solder material provides low-resistance electrical pathways between chip and substrate, enabling high-frequency and high-power operations while maintaining ease of manufacture through conventional soldering techniques
Solution Approach 2:
The solder material serves dual functions: providing strong mechanical bonding and establishing low-resistance electrical connections. This multi-functionality simultaneously addresses both mechanical strength and electrical performance requirements without complicating the manufacturing process
3Power
If high-frequency, high-power semiconductor devices are implemented, then power and frequency performance are improved, but packaging efficiency deteriorates
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional vertical integration by implementing through-substrate conductors and multi-layer stacking. This dimensional change enables compact packaging of high-power devices while maintaining electrical performance through vertical signal pathways and reduced parasitic inductance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution provides a robust and efficient packaging method that improves mechanical strength and electrical performance, enabling reliable attachment and operation of high-frequency, high-power semiconductor devices, addressing the limitations of existing technologies.
Implementation Method 1
The first solder solders the bottom conductive layer to a portion of the conductive pads
Data Source
AI summary
A chip structure includes a substrate, a bottom conductive layer, a semiconductor layer, an interlayer dielectric layer, at least one electrode, and at least one top electrode. The substrate includes in order a core layer and a composite material. The bottom conductive layer is disposed on the bottom surface of the core layer, the semiconductor layer is disposed on the substrate, and an interlayer dielectric layer is disposed on the semiconductor layer. The at least one electrode is disposed between the semiconductor layer and the interlayer dielectric layer, and the at least one top electrode is disposed on the interlayer dielectric layer and electrically coupled to the at least one electrode.