Packaged Electronic Component Foreign Object Removal With Emergency Control
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Solution Overview
Problem
Existing foreign object removal processes in electronic component packaging are prone to failure due to abnormal temperature and pressure deviations, leading to defective products and resource waste.
Innovation Solution
A foreign object removal apparatus with integrated temperature and pressure control modules, including a heater, cooler, pressurizer, and pressure relief valve, along with a control module that initiates an emergency handling program to quickly adjust temperature and pressure to safe levels when abnormalities occur, ensuring transfer to another apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature and pressure control is implemented during foreign object removal, then foreign object removal effectiveness is improved, but system complexity increases
Solution Approach 1:
The temperature and pressure control system is divided into independent modules: temperature module with heater and cooler, pressure module with pressurizer and pressure relief valve, and control module. Each module operates independently but coordinates through the control system, making the complex system manageable and maintainable while achieving reliable foreign object removal
Solution Approach 2:
The control module continuously monitors temperature and pressure parameters and adjusts the operation of heating, cooling, pressurizing, and pressure relief components in real-time based on feedback signals. This closed-loop control ensures precise maintenance of required temperature and pressure conditions for effective foreign object removal while preventing abnormal situations
2Loss of time
If emergency handling program is initiated to quickly reduce temperature, then response time to abnormal situations is improved, but risk of thermal shock to components increases
Solution Approach 1:
The cooling rate is dynamically adjusted based on real-time temperature monitoring and component sensitivity. The control module modulates the cooler operation to achieve rapid temperature reduction when necessary while preventing excessive cooling rates that could cause thermal shock, adapting the cooling intensity to the specific situation and component requirements
Solution Approach 2:
The system maintains standby cooling capacity and monitoring systems ready before abnormal situations occur. When anomalies are detected, the control module immediately activates appropriate countermeasures such as initiating emergency cooling or pressure relief procedures, preventing the situation from escalating while protecting components from harmful effects
3Object-affected harmful factors
If pressure is maintained above preset level during emergency cooling, then component protection is improved, but time to return to normal operation increases
Solution Approach 1:
The control module pre-establishes safe pressure thresholds and maintains pressure above preset levels during emergency cooling operations. By planning and executing pressure maintenance as a preliminary protective action, the system ensures component protection is already in place before full cooling effects occur, preventing damage while preparing for subsequent return to normal operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents damage to electronic components by quickly reducing temperature and slowly adjusting pressure, allowing transfer to another apparatus for continued processing and reducing defect rates.
Implementation Method 1
a heater configured to increase a working temperature in the cavity space
Implementation Method 2
a cooler configured to reduce the working temperature in the cavity space
Implementation Method 3
a pressurizer configured to increase a working pressure in the cavity space
Implementation Method 4
a pressure relief valve configured to reduce the working pressure in the cavity space
Data Source
AI summary
Provided are a foreign object removal apparatus for a packaged electronic component, and an anomaly control method thereof. The foreign object removal apparatus includes a chamber and a control module configured to control a working temperature and a working pressure of the chamber. The anomaly control method includes: obtaining the working temperature and the working pressure of the chamber; determining whether one of the working temperature and the working pressure of the chamber conforms to a default value; and when one of the working temperature and the working pressure of the chamber does not conform to the default value, starting an emergency handling program by the control module to reduce the working temperature and the working pressure until the packaged electronic component can be transferred to another foreign object removal apparatus.