Packaged Current Sensor Integrated Circuit Vibration Immunity
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Solution Overview
Problem
Conventional current sensors face challenges in accurately sensing current with high precision and efficiency due to limitations in design and materials, leading to potential power loss and mechanical instability.
Innovation Solution
A packaged current sensor integrated circuit with a primary conductor, die attach portions, and magnetic field sensing elements, including Hall effect sensors, is designed to carry current and sense magnetic fields, featuring a mechanical locking feature and secondary leads for improved isolation and reduced power loss, with a compact package body for enhanced vibration immunity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional current sensors are positioned near current-carrying conductors to sense magnetic fields, then current sensing capability is achieved, but mechanical stability and vibration immunity are poor
Solution Approach 1:
The patent combines the primary conductor, die attach portions, and semiconductor die into a single integrated package structure. The primary conductor serves dual purposes as both current path and structural support, while the die attach portions integrate mechanical mounting and electrical connection functions, creating a unified structure that improves mechanical stability without proportionally increasing complexity.
Solution Approach 2:
The package structure is segmented into distinct functional regions: primary conductor for current carrying, die attach portions for mechanical support and electrical connection, and semiconductor die for sensing. This segmentation allows each component to be optimized for its specific function while maintaining overall structural integrity and vibration immunity.
2Loss of energy
If standard packaging is used for current sensors, then manufacturing is simplified, but power loss increases and isolation is insufficient
Solution Approach 1:
The die attach portions act as intermediary elements between the primary conductor and semiconductor die, providing both mechanical support and electrical connection. This intermediary structure reduces direct contact resistance and improves current flow efficiency, thereby reducing power loss while maintaining manufacturability through standard bonding processes.
Solution Approach 2:
The package structure implements local quality optimization by concentrating current flow paths in specific low-resistance regions and providing enhanced isolation in other areas. The primary conductor is positioned and dimensioned to minimize resistive losses, while the package body provides localized isolation where needed, achieving reduced power loss without requiring complete redesign of the entire manufacturing process.
3Reliability
If compact package body is used for current sensor, then vibration immunity is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The package structure incorporates inherent mechanical cushioning through the layered construction of primary conductor, die attach portions, and package body. This cushioning effect absorbs and dampens vibration forces before they reach the semiconductor die, improving vibration immunity. The design anticipates vibration loads and builds in protective characteristics, reducing the impact of manufacturing tolerances on final performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides accurate current sensing with reduced power loss and improved mechanical stability, allowing for efficient current measurement and increased reliability in compact form factors.
Implementation Method 1
at least one magnetic field sensing element is positioned adjacent to the current conductor portion... The at least one magnetic field sensing element can be a Hall effect sensor
Data Source
AI summary
A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.