Packaged Doherty Power Amplifier With External Inter-Stage Splitter
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Solution Overview
Problem
Conventional Doherty power amplifier architectures face challenges in high-frequency and miniaturization, particularly in semiconductor package design, necessitating efficient solutions for high efficiency operation in low-cost and small footprint applications.
Innovation Solution
A multiple-stage, multiple-path power amplifier design where the power splitter and output transformer are external to the packaged semiconductor device, integrating the driver, carrier, and peaking amplifiers within the package, reducing size and cost by 30% compared to conventional designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the power splitter and output transformer are integrated within the packaged semiconductor device, then the amplifier provides complete functionality, but the size and cost increase by 30% compared to external configuration
Solution Approach 1:
The amplifier system is segmented into integrated components (driver, carrier, and peaking amplifiers within the semiconductor package) and external components (power splitter and output transformer). This segmentation allows the package to be smaller and less costly while maintaining complete amplifier functionality through the combination of internal and external elements.
Solution Approach 2:
The power splitter and output transformer are extracted from the packaged semiconductor device and placed externally. This extraction reduces the size and manufacturing cost of the package by 30% while the external components remain accessible to provide the necessary amplifier functions.
2Ease of operation
If conventional Doherty power amplifier architectures are used, then complete amplifier functionality is achieved, but the footprint and package size increase
Solution Approach 1:
The amplifier architecture transitions from a fully integrated three-dimensional package to a hybrid configuration that utilizes both internal integration and external components. This dimensional change allows the package footprint to be reduced by 30% while maintaining the Doherty amplifier's high efficiency operation through the combined internal-external component arrangement.
3Reliability
If all components are integrated within the package, then functionality is complete, but the size and cost increase by 30%
Solution Approach 1:
External interconnection elements serve as intermediaries between the packaged amplifier components and the external power splitter and output transformer. These intermediaries enable the amplifier to maintain reliable performance and complete functionality while the package volume is reduced by 30% through the external configuration of certain components.
Data Source
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AI summary
A packaged semiconductor device includes a substrate, an interface for signal communication with an external power splitter, and a first and second stages of a multiple-stage amplifier. The interface includes first, second, and third leads coupled to the substrate. The first amplifier stage includes a first amplifier die with a first input, a first output, and a first power transistor that functions as a driver amplifier. The second amplifier stage includes first and second amplifier paths. The first amplifier path has a second amplifier die with a second input, a second output, and a second transistor that functions as a first final stage amplifier. The second amplifier path has a third amplifier die with a third input, a third output, and a third transistor that functions as a second final stage amplifier. The first output, second input, and third input are coupled to the first, second, and third leads, respectively.