Packaged Integrated Device Die Between External and Internal Housing
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Solution Overview
Problem
Integrated device packages, such as those for MEMS microphones and pressure sensors, face contamination issues due to debris entering through apertures, which can degrade device performance and reliability.
Innovation Solution
The packaging design includes an external and internal housing with a channel formed between them, extending from the outside environment to the internal cavity, featuring a longer air way with bends and curves to trap debris and prevent contamination, along with optional filters and sealing materials to enhance debris capture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a direct aperture is used to allow audio signals to reach the microphone, then acoustic performance is improved, but debris can easily enter and contaminate the device
Solution Approach 1:
The patent implements nesting by placing an internal housing containing the microphone die inside an external housing. The internal cavity is nested within the external cavity, creating multiple levels of protection. This nested structure allows the device to maintain a relatively simple external form while providing enhanced contamination resistance through the internal housing and air way configuration.
Solution Approach 2:
The package is segmented into distinct functional zones: the external housing with external cavity for environmental protection, the internal housing with internal cavity for acoustic function, and the air way for controlled fluid communication. This segmentation allows each component to perform its specific function optimally while working together to solve the contamination problem.
2Reliability
If a long winding air way is used to trap debris, then contamination resistance is improved, but the device volume increases
Solution Approach 1:
The internal housing is nested within the external housing, allowing the air way to wind through the available space efficiently. This nesting enables the long air path to be accommodated within a compact overall package volume by utilizing the three-dimensional space between the nested housings.
Solution Approach 2:
The air way extends in multiple dimensions rather than a simple linear path, utilizing vertical and radial spaces between the internal and external housings. This dimensional approach allows the air path to be sufficiently long for debris trapping while maintaining a compact package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces contamination by increasing the surface area for debris accumulation and providing a longer path for debris to be trapped, thereby improving device reliability and acoustic performance.
Implementation Method 1
an air channel formed between the outside of the packaged integrated device and the internal cavity
Data Source
AI summary
Integrated devices and methods for packaging the same can include an external housing, an internal housing positioned within the external housing, and an external cavity formed between the external housing and the internal housing. An integrated device die can be positioned within the external cavity in fluid communication with an internal cavity formed by the internal lid. An air way can extend through the external cavity to the internal cavity, and can further extend from the internal cavity to the external cavity. The air way can provide fluid communication between the package exterior and the integrated device die, while reducing contamination of the integrated device die.