Packaged Module Test Socket With Warpage-Adaptive Elastic Contacts
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing testing apparatuses face issues with poor connection performance due to warpage of devices under test (DUT) caused by temperature changes, leading to inaccurate test results.
Innovation Solution
A testing apparatus with a three-dimensional stepped-stage structure and elastic conductive pillars that adapt to the warpage of DUTs, ensuring consistent contact with solder balls through a concentric annular design and flexible materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If telescopic probes are used to contact DUT soldering joints, then electrical connection for testing can be established, but connection performance deteriorates when DUT warpage increases due to temperature changes
Solution Approach 1:
The patent replaces fixed telescopic probes with elastic conductive pillars that can dynamically adjust their position. These pillars are arranged in a three-dimensional stepped-stage structure that allows them to flex and adapt to the warpage of the DUT, maintaining reliable electrical connection despite temperature-induced dimensional changes in the device under test.
Solution Approach 2:
The patent changes the physical state and arrangement of conductive elements by using elastic materials with varying degrees of flexibility. The three-dimensional stepped-stage structure creates multiple height levels that correspond to different warpage conditions, allowing the system to maintain optimal contact pressure and electrical connection across a range of temperature and warpage conditions.
2Reliability
If operator manually adjusts telescopic probe height, then connection performance can be maintained, but operation complexity and time consumption increase
Solution Approach 1:
The patent implements a self-adjusting mechanism where elastic conductive pillars automatically adapt to the DUT warpage without operator intervention. The elastic nature of the pillars allows them to self-regulate their contact pressure and position based on the actual warpage condition, eliminating the need for manual height adjustment while maintaining reliable connection performance.
Solution Approach 2:
The elastic conductive pillars act as intermediaries between the rigid circuit board and the DUT soldering joints. These pillars absorb the dimensional mismatches caused by warpage through their elastic deformation, providing a buffer that maintains electrical connection without requiring direct rigid contact or manual adjustment.
3Device complexity
If fixed-height probes are used, then device structure is simple, but test accuracy decreases when warpage occurs
Solution Approach 1:
The patent segments the conductive connection system into multiple elastic pillars arranged in a three-dimensional stepped-stage structure. This segmentation allows different regions to independently adapt to local warpage variations, maintaining test accuracy across the entire device surface while keeping each individual pillar structurally simple and easy to manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the likelihood of poor connection performance, providing accurate test results by matching the warpage outline of DUTs and maintaining uniform contact pressure.
Implementation Method 1
a plurality of elastic conductive pillars. These elastic conductive pillars are respectively inserted into the three-dimensional stepped-stage structure
Data Source
AI summary
A testing apparatus includes a circuit board, a socket and a conductive pad. The circuit board is provided with a plurality of contacts. The socket is mounted on the circuit board and provided with a receiving groove thereon. The conductive pad includes a three-dimensional stepped-stage structure and a plurality of elastic conductive pillars. The three-dimensional stepped-stage structure is received within the receiving groove, and provided with a plurality of annular steps which are arranged as concentric rectangles in sequence. Heights of the annular steps are sequentially modified according to a direction from a center point of the concentric rectangles towards the socket. These elastic conductive pillars are respectively inserted into the three-dimensional stepped-stage structure so as to be arranged separately on the annular steps. Each of the elastic conductive pillars is electrically connected to the packaged module and one of the contacts, respectively.