Packaged Patch Antenna Structure for Low-Loss mmWave Radiation
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Solution Overview
Problem
On-chip patch antennas in semiconductor packages face inefficiencies in radiation due to capacitive behavior, dielectric losses, and energy reflection/absorption, particularly in the mmWave range, leading to poor directionality and reduced operational efficiency.
Innovation Solution
The semiconductor package design includes a ground structure with metal walls and vias to direct radiated energy vertically and a mold compound with specific permittivity and loss tangent values, along with a cavity housing the patch antenna, to enhance radiation efficiency and directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional mold compound is used to cover the patch antenna, then the antenna is protected and packaged, but dielectric losses increase and radiation efficiency decreases
Solution Approach 1:
The patent changes the dielectric parameters of the mold compound by selecting materials with specific relative permittivity (3.4-3.5) and loss tangent (0.0025-0.013) ranges, optimizing the balance between protection and energy loss characteristics for mmWave operation
Solution Approach 2:
The patent employs composite material selection for the mold compound, combining materials that achieve both protective encapsulation and low dielectric loss properties, specifically targeting epoxy-based compounds with controlled filler content to maintain low loss tangent
2Volume of moving object
If the patch antenna is positioned close to the ground plane, then the device footprint is reduced, but capacitive behavior increases and radiation efficiency decreases
Solution Approach 1:
The patent introduces vertical dimension optimization by positioning the patch antenna at a specific height above the ground plane within the package, using the z-dimension to manage capacitive effects while maintaining a compact x-y footprint through controlled dielectric layer thickness
3Loss of energy
If the patch antenna is positioned far from the ground plane, then capacitive behavior is reduced and radiation efficiency improves, but the device footprint and height increase
Solution Approach 1:
The patent optimizes the vertical spacing parameter between the patch antenna and ground plane to achieve optimal radiation efficiency while constraining the overall package volume through precise control of dielectric layer thickness and antenna positioning
4Ease of manufacture
If standard materials are used for the mold compound, then manufacturing is simplified, but radiation efficiency and directionality are compromised
Solution Approach 1:
The patent specifies precise parameter ranges for mold compound properties (relative permittivity 3.4-3.5, loss tangent 0.0025-0.013) that balance manufacturing availability with optimized radiation efficiency, selecting from commercially available epoxy-based materials that meet these criteria
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves radiation efficiency by directing energy in the desired direction, achieving a 20% increase in radiation efficiency and maintaining superior performance across the mmWave frequency range.
Implementation Method 1
The mold compound has a relative permittivity ranging from 3.4 to 3.5 and a loss tangent ranging from 0.0025 to 0.013
Implementation Method 2
The mold compound has a relative permittivity ranging from 3.4 to 3.5 and a loss tangent ranging from 0.0025 to 0.013
Implementation Method 3
a patch antenna coupled to the conductive layer and to the device side of the semiconductor substrate
Implementation Method 4
The package also includes a ground structure with metal walls and vias to direct radiated energy vertically
Data Source
AI summary
In examples, a semiconductor package comprises a semiconductor substrate including a device side having circuitry formed therein. The package also includes a conductive layer positioned above the semiconductor substrate; a patch antenna coupled to the conductive layer and to the device side of the semiconductor substrate; and a mold compound covering the patch antenna. The mold compound has a relative permittivity ranging from 3.4 to 3.5 and a loss tangent ranging from 0.0025 to 0.013.