Packageless Semiconductor Device with Conductive Via and Coplanar Bond Pad
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Solution Overview
Problem
Existing semiconductor components, such as diodes, face challenges in reducing size and cost while maintaining functionality, particularly in compact devices like cell phones and PDAs, where plastic packaging occupies space and increases costs.
Innovation Solution
A packageless semiconductor device is developed, featuring a substrate with an epitaxial layer and conductive via extending through it, along with a bond pad, fabricated using Si-based p-type-intrinsic-n-type (PIN) diodes, allowing for flip-chip bonding and reducing size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If plastic packaging is used for semiconductor components, then ease of handling and protection during assembly is improved, but device size and cost increase
Solution Approach 1:
The patent removes the plastic packaging entirely from the semiconductor component structure. The semiconductor device is presented in a bare, unpackaged form that can be directly mounted onto circuit boards through flip-chip bonding, eliminating the volume and cost associated with traditional plastic carriers while maintaining functionality through direct electrical connections via conductive vias and bond pads
2Reliability
If plastic packaging is used for semiconductor components, then protection during assembly is improved, but cost increases significantly
Solution Approach 1:
The patent eliminates the plastic packaging structure entirely, reducing manufacturing cost by removing the carrier substrate, molding compounds, and associated assembly steps. The semiconductor device is protected and handled through standard semiconductor manufacturing processes and direct mounting techniques, achieving cost reduction while maintaining assembly capability through the robust conductive via and bond pad structure
Solution Approach 2:
The patent changes the structural parameters of the semiconductor device by removing the packaging layer and exposing the conductive vias and bond pads for direct electrical connection. This parameter change from packaged to unpackaged form enables cost reduction while maintaining functionality through direct mounting and bonding processes
3Ease of operation
If traditional packaged structure is used, then ease of handling is improved, but space requirement increases
Solution Approach 1:
The patent removes the plastic carrier and packaging structure that occupy additional space on circuit boards. The unpackaged semiconductor device with exposed bond pads and conductive vias can be directly mounted in a flip-chip configuration, significantly reducing the footprint and space requirement while maintaining handling capability through standard semiconductor assembly processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The packageless semiconductor device achieves significant size reduction and cost savings compared to traditional packaged components, maintaining performance and functionality in various electronic devices.
Implementation Method 1
an epitaxial layer disposed over the second side
Data Source
AI summary
A semiconductor device includes a substrate having a first side and a second side and an epitaxial layer disposed over the second side. The device also includes a conductive via extending through the epitaxial layer to the second side and comprising a conductive contact; and a bond pad disposed over the epitaxial layer and comprising a conductive material, wherein the semiconductor is not provided in a package.