Packaging Box Film Applicator for Electronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional film application for electronic devices is inefficient due to manual alignment and adhesion issues, leading to imprecise application, waste of materials, and dust accumulation, which results in low efficiency and an unattractive appearance.
Innovation Solution
A packaging box with a built-in film applicator system that includes a covering film with a main layer and removable release layers, and a recessed design that allows for precise alignment and adhesion, using static electricity to attract and remove dust, and an elastic pressing portion to apply even pressure, reducing bubble formation and dust accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual alignment and adhesion adjustment are performed during film application, then the film can be applied to the electronic device surface, but imprecise alignment and bubbles are formed requiring re-application causing low efficiency and material waste
Solution Approach 1:
The packaging box pre-defines the exact position where the film will be applied through its recess structure. The film is stored in the recess in advance, and the electronic device is placed in the recess before film application, pre-establishing the alignment reference. This eliminates the need for manual alignment adjustment during the application process, thereby improving both alignment precision and application efficiency.
2Ease of operation
If manual film application is performed without precise alignment, then the process is simpler, but edges of the protective film are not thoroughly adhered allowing dust to accumulate appearing unattractive
Solution Approach 1:
The packaging box's recess structure pre-establishes the correct film position and ensures complete edge coverage before the application process begins. The film is pre-cut to match the recess dimensions, guaranteeing that when applied, the film edges will be thoroughly adhered to the device surface, preventing dust accumulation while maintaining operational simplicity.
3Manufacturing precision
If additional film application tools are used to improve precision, then alignment accuracy improves, but device complexity and cost increase
Solution Approach 1:
The packaging box is designed to serve multiple functions: it stores the film, defines the application position, guides the film during application, and even removes dust through its pressing portion. By making the packaging box multi-functional, the invention eliminates the need for separate alignment tools and dust removal devices, thereby improving alignment precision without increasing system complexity or cost.
4Device complexity
If the packaging box serves as the film applicator, then additional tools are eliminated reducing cost, but the packaging box structure must be more complex
Solution Approach 1:
The invention merges the packaging box with the film applicator functions by integrating the film storage recess, alignment guides, and dust removal pressing portion into a single structure. This consolidation eliminates the need for separate applicator tools while the integrated design keeps the structural complexity manageable by combining multiple functions into one unified component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a convenient, efficient, and precise film application process that prevents dust accumulation and bubble formation, ensuring a clean and accurate protective film application on electronic devices without the need for additional tools, reducing costs and improving user experience.
Implementation Method 1
an adhesive is present on a surface of the main layer in contact with the first release layer, and when the first release layer is removed, the adhesive on the main layer is in contact with the electronic device such that the main layer is adhered on the electronic device
Implementation Method 2
by mutually covering the upper cover and the lower cover and with pressing of the pressing portion, the electronic device is closely pressed against the covering film
Implementation Method 3
the first release layer and the second release layer are separately attracted by static electricity to the top surface and the bottom surface of the main layer
Data Source
AI summary
The present invention discloses a packaging box of a covering film and a film applicator. By structural designs of the packaging box and the covering film, the packaging box is provided with an internal cavity matching an outer shape of an electronic device and the covering film includes a release film having an extension portion, enabling the packaging box to provide the covering film with storage, dustproof and shock-absorbing functions and to further serve as a film application auxiliary tool when a film application process is performed. Thus, a user is allowed to accurately, quickly and efficiently form a layer providing protection on a surface of the electronic device directly by using the packaging box.