Electronic Packaging Structure With Cavity And Coaxial Via
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Solution Overview
Problem
Current electronic packaging structures face challenges in protecting electronic devices and reducing signal divergence during radio frequency transmission, often resulting in larger sizes and increased weight.
Innovation Solution
The proposed electronic packaging structure includes a first circuit structure with a bottom conductive plate having a cavity, electrically connected to a second circuit structure, with an electronic device positioned within the cavity and connected via a coaxial conductive via, which includes an inner and outer conductive layer separated by a dielectric layer, providing enhanced protection and improved signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip is covered by a film sealing material to form the chip package structure, then the chip is protected, but the electronic device is difficult to be protected well and the structure has larger size
Solution Approach 1:
The patent implements nesting by placing the electronic device (chip) inside a cavity formed in the circuit board, rather than covering it with external sealing material. The cavity is created by removing material from the circuit board, and the chip is positioned within this recessed space, providing protection while maintaining a compact overall structure.
Solution Approach 2:
The patent transitions from a planar packaging approach (covering the chip with film material on the same plane) to a three-dimensional approach by creating a cavity that extends vertically into the circuit board. This dimensional change allows the chip to be housed within the board thickness, reducing the horizontal footprint and overall package size.
2Reliability
If the antenna structure is disposed on the chip package structure with conductive pillar penetrating the film sealing material, then the antenna is electrically connected to the circuit board, but the signal divergence is not reduced effectively and the size is larger
Solution Approach 1:
The patent extracts the conductive connection elements (conductive pillars and conductive vias) from the traditional approach of penetrating through external sealing material, and instead integrates them directly into the circuit board structure. The conductive pillars are formed within the circuit board itself, and conductive vias are created through the board to establish electrical connections, eliminating the need for separate sealing material penetration paths.
Solution Approach 2:
The patent merges the functions of the sealing material and the electrical connection pathway into a single integrated circuit board structure. The cavity that protects the electronic device also houses the conductive connection elements, combining mechanical protection and electrical connectivity functions within the same structural framework, thereby reducing signal divergence paths.
3Ease of manufacture
If the conventional chip package structure is used with film sealing material, then the manufacturing process is simple, but the electronic device protection is insufficient and signal interference occurs
Solution Approach 1:
The patent applies local quality by creating a specific cavity region within the circuit board with different structural characteristics from the surrounding areas. The cavity provides localized protection for the electronic device, while conductive vias and shielding structures are strategically positioned in specific locations to address signal interference issues without requiring complete structural redesign.
Data Source
AI summary
An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The first circuit structure includes a bottom conductive plate having at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.