Packaging Structure With Exposed Connector For 5G Antenna Integration

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Solution Overview

Problem

Conventional wireless communication devices face challenges in miniaturization and space constraints for 5G antenna components, as well as inefficient electrical communication with internal components due to limited antenna placement and complex packaging structures.

Innovation Solution

A packaging structure and method that integrates an antenna module with a carrier, electronic components, and a connector, where the connector's port is exposed from the packaging layer, allowing direct electrical connection to a motherboard and enabling flexible antenna placement for improved signal strength, while simplifying the fabrication process and reducing packaging volume.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the antenna component is positioned in proximity to the housing to maximize signal strength, then the wireless transmission performance is improved, but the available space for placing the antenna component is limited and the device miniaturization becomes difficult

Engineering Contradiction:
Improvewireless transmission performanceVSAvoiddevice volume
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The antenna component is integrated with the circuit board to form a unified structure. The antenna component includes a first circuit board and a second circuit board connected through connection portions, creating a compact merged assembly that reduces overall device volume while maintaining signal strength through optimized proximity to the housing.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The antenna component utilizes three-dimensional spatial arrangement with connection portions extending in multiple directions. The first and second circuit boards are positioned at different heights and connected through vertical and horizontal connection portions, effectively utilizing vertical space to reduce the device's horizontal footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the antenna component is positioned near the housing, then signal strength is maximized, but the electrical communication with internal components disposed in the center becomes complex

Engineering Contradiction:
Improvesignal strengthVSAvoidelectrical communication complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The circuit board serves multiple functions: it acts as the structural base for the antenna component, provides electrical connection pathways through its connection portions, and enables communication between the antenna and internal components. This multi-functional design simplifies the overall electrical communication architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The connection portions of the circuit board act as intermediaries that bridge the antenna component positioned near the housing with the internal components located in the center. These connection portions provide direct electrical pathways, eliminating the need for complex routing through multiple intermediate components.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional packaging structures are used, then the fabrication process is complex and the packaging volume is large, but the electrical performance and power efficiency are compromised

Engineering Contradiction:
Improvefabrication simplicityVSAvoidpower loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The antenna component is packaged by integrating it directly with the circuit board structure. The connection portions of the circuit board serve as both structural support and electrical connection elements, eliminating the need for separate packaging components and reducing overall packaging volume while improving electrical performance.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11233324B2Packaging structure and method for fabricating the same
Publication Date: 2022.01.25 SILICONWARE PRECISION IND CO LTD
  • US11233324B2 patent drawing
  • US11233324B2 patent drawing
  • US11233324B2 patent drawing

AI summary

Provided is a packaging structure, which includes a carrier and an electronic component, an antenna module and a connector disposed on the carrier, and a packaging layer encapsulating the electronic component and the connector. A portion of a surface of the connector is exposed from the packaging layer so as to facilitate the electrical connection with a motherboard of an electronic product. A method for fabricating the packaging structure is also provided.