Packaging Structure with Exposed Lead Frame for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current packaging structures lack effective heat dissipation capabilities, which is a critical area for improvement in the field of packaging technology.
Innovation Solution
A packaging structure is designed with a lead frame having recessed regions on its surface, where chips are fixed and partially exposed to enhance heat dissipation, and optionally includes a heat-dissipating member to further improve thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chips are fully enclosed by packaging material, then protection and insulation are improved, but heat dissipation ability deteriorates
Solution Approach 1:
The patent applies local quality by creating a recessed region in the lead frame where the chip is mounted, and selectively exposing specific surfaces (chip back surface and lead frame first surface) to the external environment while maintaining full encapsulation of other areas. This localized exposure strategy enables heat dissipation from critical areas while preserving the protective encapsulation of the overall structure, thus resolving the contradiction between protection and heat dissipation.
2Temperature
If heat-dissipating member is added, then heat dissipation ability is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat-dissipating member with the existing lead frame structure, integrating thermal management functionality into the structural component already present in the package. The heat-dissipating member is positioned to thermally contact the chip and extend to the exposed first surface of the lead frame, creating a combined structural-thermal management system that improves heat dissipation without adding completely separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat generated by the chips through the exposed surfaces of the lead frame and chips, enhancing the overall heat dissipating ability while maintaining structural integrity and strength.
Implementation Method 1
The first surface of the heat-dissipating member thermally contacts the second surface of the first chip
Data Source
AI summary
A packaging structure includes a lead frame, a chip, and a packaging material. The lead frame has a pair of opposed first surface and second surface, and has a first recessed region located on the second surface. The chip has a pair of opposed first surface and second surface. The first surface of the chip is fixed on the first recessed region. The packaging material surrounds the lead frame and the chip. The second surface of the chip is exposed from the packaging material, and the first surface of the lead frame is exposed from the packaging material.