Packaging-Free Accelerometer for Hard Disk Free-Fall Detection
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Solution Overview
Problem
Current accelerometer devices for portable electronic devices, such as laptops and hard disks, are too thick to be integrated within the device they are meant to protect, leading to delays in free-fall detection and inadequate protection against impact damage due to their large physical dimensions.
Innovation Solution
A portable apparatus with an accelerometer device that integrates a sensor element and conditioning electronics without packaging, using external and internal conductive bumps for direct electrical connection to a supporting element, allowing for reduced thickness and enhanced integration within the device, such as a hard disk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional packaged accelerometer devices are used, then the device is protected from environmental factors, but the thickness becomes excessive (1.5-2 mm) and cannot be integrated within the hard disk
Solution Approach 1:
The patent extracts the sensor element from its traditional packaged housing and directly integrates it onto the hard disk circuit board. The sensor element is mounted in a exposed configuration without a protective package, eliminating the 1.5-2 mm thickness requirement and enabling integration within the hard disk's limited space.
Solution Approach 2:
The patent merges the accelerometer sensor element directly with the hard disk's electronic circuit board by mounting it onto the circuit board traces. This integration combines the protection function with the structural support of the hard disk housing, eliminating the need for a separate protective package.
2Speed
If accelerometer device is positioned outside the hard disk, then it can be easily installed, but communication delays prevent prompt detection of free-fall conditions
Solution Approach 1:
The patent merges the accelerometer sensor element directly with the hard disk's electronic circuit board by mounting it onto the circuit board traces. This integration combines the detection function with the control system, eliminating communication delays and enabling immediate response to free-fall conditions.
Solution Approach 2:
The patent segments the accelerometer functionality into a separate sensor element that can be independently mounted onto the circuit board. This allows the sensor to be positioned optimally close to the hard disk components for immediate detection, while maintaining electrical connection through the circuit board traces.
3Ease of manufacture
If wire-bonding technique is used for electrical connection, then reliable electrical connection is achieved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent replaces the mechanical wire-bonding process with direct electrical connection through circuit board traces. The sensor element's contact pads are directly connected to the circuit board traces, eliminating the need for wire bonding and simplifying the manufacturing process while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables faster free-fall detection and protection, reduces thermomechanical stresses, and facilitates easier calibration, with the accelerometer device achieving a thickness of less than 0.7 mm, approximately half that of traditional devices, allowing for quicker response times and improved reliability.
Implementation Method 1
a first body of semiconductor material integrating a sensor element configured to detect movements of said first body and generating a signal correlated to said movements
Data Source
AI summary
A portable apparatus having an accelerometer device and a supporting element in the accelerometer device, having a first body of semiconductor material integrating a sensor element that detects movements of the first body and generates a signal correlated to the detected movement; a second body of semiconductor material that integrates a conditioning electronics and that is electrically connected to the first body; and conductive bumps that provide electrical connection of the first and second bodies to the supporting element. In particular, the conductive bumps connect the first and second bodies to the supporting element without the interposition of any packaging.