Semiconductor Packaging Isolation Layer Against Mold Particle Damage

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Solution Overview

Problem

In the semiconductor packaging process, foreign particulate matters or impurities tend to adhere to the mold surface of the packaging apparatus, causing dents on the substrate surface and resulting in appearance degradation and functional damage of the packaged product.

Innovation Solution

A packaging method and apparatus that involves disposing an isolation layer on the surface of the upper mold of the packaging apparatus, which separates the substrate from the mold surface, effectively preventing foreign particulate matters from damaging the substrate during the molding process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If compression molding process is used for semiconductor packaging, then high material utilization and suitability for large scale frame plastic packaging are achieved, but foreign particulate matters adhere to the mold surface causing substrate damage

Engineering Contradiction:

Improvelarge scale frame plastic packagingVSAvoidforeign particulate matter adhesion

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a release film as an intermediary layer between the mold surface and the substrate. This release film prevents direct contact between foreign particulate matters on the mold surface and the substrate, thereby eliminating the harmful effect of particulate adhesion while maintaining the compression molding process benefits for large scale packaging

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the mold surface is used directly without isolation layer, then the packaging process is simple, but foreign particulate matters cause dents on substrate surface leading to appearance degradation and functional damage

Engineering Contradiction:

Improvepackaging process simplicityVSAvoidsubstrate surface quality

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent employs a disposable release film that is used for each packaging cycle and then discarded. This inexpensive, single-use component effectively protects substrate surface quality by preventing particulate adhesion, while the simplicity of the overall process is maintained because the release film requires minimal handling and preparation

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS20250079191A1Packaging methods and packaging apparatus

Publication Date: 2025.03.06 YANGTZE MEMORY TECH CO LTD

AI summary

The present disclosure relates to a packaging method and a packaging apparatus. The packaging method includes performing a first packaging operation on a first mold of a packaging apparatus, the first packaging operation including: disposing an isolation layer on the first surface of the first mold; and acquiring, by the first mold, a substrate to be packaged after disposing the isolation layer, wherein the substrate is separated from the first surface of the first mold by the isolation layer; performing a second packaging operation on a second mold of the packaging apparatus, the second packaging operation including: disposing a compound for packaging in the second mold; and closing the first mold and the second mold after completing the first packaging operation and the second packaging operation to form a semiconductor package.