Packaging Member Light Scattering Structure for Color Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In liquid crystal display apparatuses with edge-lit backlight sources, the color of light emitted near the light bar differs significantly from the color of light emitted away from the light bar due to uneven light distribution, leading to inconsistent color uniformity.
Innovation Solution
A packaging member with a cup-shaped support, a light-emitting chip, and packaging glue mixed with a photoluminescent material, featuring a light scattering structure with grooves and convex reflective surfaces to scatter light uniformly, is used to improve color consistency. The manufacturing method involves filling the support with the glue and curing it to form the scattering structure, which includes grooves and sub-grooves on the packaging glue surface to disperse light evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional packaging structure without light scattering structure is used, then the manufacturing process is simple, but the color uniformity of the light emitted is poor
Solution Approach 1:
The packaging glue is segmented into multiple regions with different functions: a light scattering structure with grooves and convex reflective surfaces is integrated into the packaging glue to create distinct optical zones. This segmentation allows different parts of the packaging glue to perform different optical functions, improving color uniformity while maintaining a single integrated component.
Solution Approach 2:
The packaging glue is formulated as a composite material containing photoluminescent particles mixed throughout the glue matrix. This composite structure enables the packaging glue to simultaneously provide mechanical support, optical scattering, and light conversion functions, achieving improved color uniformity without adding separate components.
2Manufacturing precision
If the light scattering structure with grooves and convex reflective surfaces is added, then the color uniformity is improved, but the manufacturing complexity increases
Solution Approach 1:
The light scattering structure is merged with the packaging glue as a single integrated component. The grooves and convex reflective surfaces are formed directly within the packaging glue material itself, combining the packaging glue function and light scattering function into one manufacturable part, thereby reducing assembly complexity.
Solution Approach 2:
The packaging glue's physical and optical parameters are modified by incorporating photoluminescent particles and forming specific groove structures. These parameter changes enable the packaging glue to achieve the desired light scattering and color uniformity properties while remaining manufacturable as a single material component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The light scattering structure enhances color uniformity across the surface light field of the light-emitting chip, reducing the color difference between regions close to and away from the light bar in the backlight source assembly, resulting in a more consistent light emission.
Implementation Method 1
packaging glue mixed with a photoluminescent material
Implementation Method 2
light scattering structure configured to scatter light
Implementation Method 3
inner surface of the support includes a plurality of convex reflective surfaces
Data Source
AI summary
A packaging member and a manufacturing method therefor, a backlight source assembly, and a display apparatus. The packaging member comprises a cup-shaped support (1), a light-emitting chip (2), and a packaging glue (3) mixed with a photoluminescent material (4); the light-emitting chip (2) is fixed at the bottom of the support (1) and emits light towards an opening of the support (1); the packaging glue (3) covers the light-emitting chip (2); and the packaging member comprises a light scattering structure, and the light scattering structure is configured to scatter light.


