Packaging Structure Metal Layer Electromagnetic Shielding
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Solution Overview
Problem
Existing packaging structures face challenges with electromagnetic interference between high-frequency devices, requiring shields that need re-design for different layouts and resulting in increased size and height, which contradicts the goals of low profile and compact size.
Innovation Solution
A packaging structure with a substrate featuring a metal layer formed on both packaging elements, an encapsulant covering the first antenna, and conductive holes connecting to a second antenna on the encapsulant, allowing for flexible layout adjustments without gaps and eliminating the need for a cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shields are designed to correspond in position to packaging elements, then electromagnetic interference is eliminated, but the cover must be re-designed for different layouts and the structure size increases
Solution Approach 1:
The metal layer is formed to extend continuously across both first and second packaging elements, creating a universal shielding structure that does not require re-design when packaging element layouts change. This continuous metal layer serves multiple packaging configurations simultaneously, eliminating the need for layout-specific shield designs.
Solution Approach 2:
The patent merges the shielding function with the substrate structure by forming the metal layer directly on the substrate beneath the packaging elements. This integration eliminates the need for separate shield components and their corresponding mounting structures, reducing overall device complexity and size.
2Object-affected harmful factors
If gaps are maintained between shields and packaging elements, then electromagnetic interference is reduced, but the substrate size and packaging height increase
Solution Approach 1:
The metal layer is formed to be in direct contact with the packaging elements, merging the shield structure with the packaging structure. This eliminates gaps between shields and packaging elements while maintaining electromagnetic interference reduction, thereby reducing packaging height and substrate size.
Solution Approach 2:
The continuous metal layer copying the contour of the packaging elements provides shielding without requiring physical separation or gaps. The metal layer conformally follows the packaging element surfaces, achieving shielding effectiveness with minimal space requirement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the size and height of the packaging structure, enhances electromagnetic shielding, and allows for flexible design modifications without increasing costs, while eliminating the need for a cover, thus supporting miniaturization and improved interference reduction.
Implementation Method 1
a metal layer formed on the second packaging element
Implementation Method 2
an adhesive material 15 adheres the cover 1b to the substrate 10
Data Source
AI summary
A packaging structure and a method of fabricating the same are provided. The packaging structure includes a substrate, first packaging element disposed on the substrate, a second packaging element disposed on the substrate and spaced apart from the first packaging element, a first antenna disposed on the first packaging element, and a metal layer formed on the second packaging element. The installation of the metal layer and the antenna enhances the electromagnetic shielding effect.