Double-Sided Packaging Module Layout for Power Semiconductor Cooling
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Solution Overview
Problem
Conventional power semiconductor devices face challenges with single-sided heat dissipation, leading to inefficient heat management, which can result in high temperatures, reduced efficiency, and potential component failure due to the difficulty in discharging internal heat effectively.
Innovation Solution
A packaging module with a circuit substrate and dual heat dissipation apparatuses, where the first heat dissipation apparatus is mounted on the back surface and the second on the front surface, allowing for double-sided heat dissipation without obstructing pin lead-outs, utilizing thermally conductive components and redistribution layers to enhance heat transfer and module reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If single-sided heat dissipation is used, then the structure is simple, but the heat dissipation capability is limited and internal heat cannot be discharged in time
Solution Approach 1:
The patent transitions from single-sided heat dissipation to double-sided heat dissipation by adding heat dissipation apparatus on both the front surface and back surface of the circuit board. This dimensional expansion allows heat to be discharged from multiple directions simultaneously, significantly improving heat dissipation capability without excessive structural complexity
Solution Approach 2:
The heat dissipation function is segmented into multiple independent heat dissipation apparatus positioned at different locations and orientations. The first heat dissipation apparatus is mounted on the back surface while the second is mounted on the front surface, creating distributed heat dissipation paths that enhance overall thermal management effectiveness
2Temperature
If double-sided heat dissipation is implemented, then heat dissipation efficiency is improved, but the pin lead-out may be obstructed
Solution Approach 1:
The circuit board is divided into functionally distinct regions: a heat dissipation region for mounting heat dissipation apparatus and an edge region for pin lead-out. This local differentiation ensures that heat dissipation components are positioned in areas that do not interfere with electrical connection requirements, allowing both functions to coexist without obstruction
Solution Approach 2:
The patent utilizes the z-dimension (vertical stacking) by implementing heat dissipation on both surfaces of the circuit board. This allows heat dissipation apparatus to be positioned in three-dimensional space without occupying the same planar space needed for pin lead-out, resolving the spatial conflict between thermal management and electrical connection
3Power
If power semiconductor devices are made thinner and smaller, then power density increases, but heat dissipation requirement becomes increasingly high
Solution Approach 1:
The patent employs double-sided heat dissipation that utilizes both surfaces of the thin circuit board, effectively doubling the heat dissipation surface area available. This dimensional approach allows high power density devices to maintain adequate thermal management despite reduced thickness and size, as heat can escape from both front and back surfaces simultaneously
Solution Approach 2:
The thermal management system is segmented into multiple heat dissipation apparatus positioned at different locations on the circuit board surfaces. This segmentation creates multiple independent heat dissipation pathways, allowing efficient heat removal from high-power-density components without requiring increased device thickness or size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation efficiency, extends the service life, and enables the development of power semiconductor devices with higher density, thinner, and smaller designs by effectively managing heat on both sides of the component.
Implementation Method 1
The first heat dissipation apparatus is located on a surface, away from the first electronic component, of the first line layer. The second heat dissipation apparatus is located on a surface, away from the first electronic component, of the heat dissipation region.
Implementation Method 2
utilizing thermally conductive components and redistribution layers to enhance heat transfer and module reliability
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
This application provides a packaging module, including a circuit substrate, a first heat dissipation apparatus, and a second heat dissipation apparatus. The circuit substrate includes a first line layer, a first packaging layer, and a second line layer that are sequentially stacked. The first line layer is electrically connected to a first electronic component. The second line layer includes a heat dissipation region and an edge region that is connected to the heat dissipation region. The first electronic component is further electrically connected to the heat dissipation region. The edge region is electrically connected to a lead terminal. The first packaging layer packages the first electronic component and the first line layer. The first heat dissipation apparatus is located on a surface of the first line layer. The second heat dissipation apparatus is located on a surface of the heat dissipation region. This application further provides a method for preparing the packaging module and an electronic device using the packaging module. According to the packaging module in this application, the first line layer and the second line layer are designed in a way that heat dissipation apparatuses can be mounted on both a front surface and a back surface of the first electronic component, to implement double-sided heat dissipation, thereby improving heat dissipation efficiency.