Packaging Substrate Adhesion Layer for Low-Roughness Conductors
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Solution Overview
Problem
Existing semiconductor packaging technologies struggle to effectively package high-performance, high-frequency semiconductor devices due to high resistance and limited wiring pitch, particularly in ceramic and resin substrates, while silicon and glass substrates offer potential but require improved adhesion and electrical connectivity.
Innovation Solution
A packaging substrate design featuring a core layer, a conductive layer with controlled surface roughness, and an adhesion reinforcement layer made of silicon-based or acrylic-based compounds, which enhances adhesion and stability of insulating layers, allowing for stable electrical connections and reduced resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a ceramic substrate is used for packaging, then structural stability is improved, but electrical resistance increases and dielectric constant becomes too high for high-frequency devices
Solution Approach 1:
The patent uses a glass substrate as a composite material that combines the structural stability of ceramic materials with the electrical performance characteristics of resin materials, achieving both mechanical strength and low dielectric constant for high-frequency applications
Solution Approach 2:
The patent modifies the substrate material from traditional ceramic to glass, changing the fundamental material parameters (dielectric constant, resistance) while maintaining structural stability, thereby resolving the contradiction between mechanical strength and electrical performance
2Reliability
If a resin substrate is used for packaging, then electrical performance is improved, but wiring pitch cannot be reduced sufficiently
Solution Approach 1:
The glass substrate provides a balanced combination of electrical properties and mechanical rigidity, enabling both good electrical performance and precise wiring fabrication with reduced pitch
3Reliability
If silicon or glass substrate with through-holes is used, then wiring length is reduced and electrical characteristics improve, but adhesion between layers deteriorates
Solution Approach 1:
The patent introduces an adhesion reinforcement layer as an intermediary between the glass substrate and conductive layers, specifically using silane coupling agents that chemically bond to both the glass surface and metal conductors, thereby resolving the adhesion problem while maintaining electrical performance
4Strength
If surface roughness of conductive layer is increased to improve adhesion, then adhesion strength is improved, but electrical resistance increases
Solution Approach 1:
The adhesion reinforcement layer acts as a mediator that decouples the relationship between surface roughness and adhesion, allowing the conductive layer to maintain smooth surface (low resistance) while the intermediary layer provides the necessary adhesion reinforcement through chemical coupling
Solution Approach 2:
The patent changes the adhesion mechanism from mechanical interlocking (requiring rough surfaces) to chemical bonding through silane coupling agents, allowing smooth surfaces to achieve strong adhesion without increased resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved adhesion and electrical reliability, enabling high-frequency signal transmission and stable integration of semiconductor devices, with enhanced durability and reduced resistance.
Implementation Method 1
an adhesion reinforcement layer disposed on the core layer and surrounding at least a portion of an upper surface of the first conductive layer
Implementation Method 2
An arithmetic average roughness (Ra) of the upper surface of the first conductive layer is 150 nm or less
Data Source
AI summary
A packaging substrate according to the present disclosure comprises a core layer; a first conductive layer, which is a conductive layer disposed in contact with an upper surface of the core layer; and an adhesion reinforcement layer disposed on the core layer and surrounding at least a portion of the first conductive layer. The adhesion reinforcement layer comprises any one selected from the group consisting of a silicon-based compound, an acrylic-based compound, and a combination thereof. An arithmetic average roughness (Ra) value of the upper surface of the first conductive layer is 150 nm or less.In this case, it is possible to effectively improve the adhesion strength of the insulating layer to the first conductive layer without excessively roughening the first conductive layer.